SN74LVC1G18_07 Datasheet, PDF (1/13 Pages) Texas Instruments – 1-OF-2 NONINVERTING DEMULTIPLEXER WITH 3-STATE DESELECTED OUTPUT

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FEATURES
• Available in the Texas Instruments
NanoFree™ Package
• Supports 5-V V_CC Operation
• Inputs Accept Voltages to 5.5 V
• Max t_pd of 3.4 ns at 3.3 V
• Low Power Consumption, 10-µA Max I_CC
• ±24-mA Output Drive at 3.3 V
• Typical V_OLP (Output Ground Bounce)
<0.8 V at V_CC = 3.3 V, T_A = 25°C
• Typical V_OHV (Output V_OH Undershoot)
>2 V at V_CC = 3.3 V, T_A = 25°C
DBV PACKAGE
(TOP VIEW)
S
1
GND
2
6
Y₀
5
V_CC
A
3
4
Y₁
SN74LVC1G18
1-OF-2 NONINVERTING DEMULTIPLEXER
WITH 3-STATE DESELECTED OUTPUT
SCES406I – JULY 2002 – REVISED JANUARY 2007
• I_off Supports Partial-Power-Down Mode
Operation
• Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DCK PACKAGE
(TOP VIEW)
S
1
6
Y₀
GND
2
5
V_CC
A
3
4
Y₁
YZP PACKAGE
(BOTTOM VIEW)
A ³⁴
GND ^{2 5}
S ¹⁶
Y₁
V_CC
Y₀
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This noninverting demultiplexer is designed for 1.65-V to 5.5-V V_CC operation.
The SN74LVC1G18 is a 1-of-2 noninverting demultiplexer with a 3-state output. This device buffers the data on
input A and passes it to either output Y0 or Y1, depending on whether the state of the select (S) input is low or
high, respectively.
ORDERING INFORMATION
T_A
–40°C to 85°C
PACKAGE ⁽¹⁾
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SOT (SOT-23) – DBV
Reel of 3000
Reel of 3000
ORDERABLE PART NUMBER TOP-SIDE MARKING⁽²⁾
SN74LVC1G18YZPR
_ _ _CJ_
SN74LVC1G18DBVR
C18_
SOT (SC-70) – DCK
Reel of 3000 SN74LVC1G18DCKR
CJ_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2007, Texas Instruments Incorporated