SN74LVC1G18 Datasheet, PDF (1/13 Pages) Texas Instruments – 1-OF-2 NONINVERTING DEMULTIPLEXER WITH 3-STATE DESELECTED OUTPUT

D Available in the Texas Instruments
NanoStar and NanoFree Packages
D Supports 5-V V_CC Operation
D Inputs Accept Voltages to 5.5 V
D Max t_pd of 3.4 ns at 3.3 V
D Low Power Consumption, 10-µA Max I_CC
D ±24-mA Output Drive at 3.3 V
D Typical V_OLP (Output Ground Bounce)
<0.8 V at V_CC = 3.3 V, T_A = 25°C
D Typical V_OHV (Output V_OH Undershoot)
>2 V at V_CC = 3.3 V, T_A = 25°C
D I_off Supports Partial-Power-Down Mode
Operation
D Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II
D ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
SN74LVC1G18
1-OF-2 NONINVERTING DEMULTIPLEXER
WITH 3-STATE DESELECTED OUTPUT
SCES406G – JULY 2002 – REVISED SEPTEMBER 2003
DBV OR DCK PACKAGE
(TOP VIEW)
S¹
GND ²
A³
6 _Y0
5 _VCC
4 _Y1
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
A 3 4 Y1
GND 2 5 V_CC
S 1 6 Y0
description/ordering information
This noninverting demultiplexer is designed for 1.65-V to 5.5-V V_CC operation.
The SN74LVC1G18 is a 1-of-2 noninverting demultiplexer with a 3-state output. This device buffers the data
on input A and passes it to either output Y0 or Y1, depending on whether the state of the select (S) input is low
or high, respectively.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
NanoStar – WCSP (DSBGA)
0.17-mm Small Bump – YEA
SN74LVC1G18YEAR
–40°C to 85°C
NanoFree – WCSP (DSBGA)
0.17-mm Small Bump – YZA (Pb-free)
NanoStar – WCSP (DSBGA)
0.23-mm Large Bump – YEP
Reel of 3000
SN74LVC1G18YZAR
SN74LVC1G18YEPR
_ _ _CJ_
NanoFree – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SN74LVC1G18YZPR
SOT (SOT-23) – DBV
Reel of 3000 SN74LVC1G18DBVR
C18_
SOT (SC-70) – DCK
Reel of 3000 SN74LVC1G18DCKR
CJ_
† _{Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at}
www.ti.com/sc/package.
‡ _{DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.}
YEA/YZA,YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright  2003, Texas Instruments Incorporated
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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