SN74LVC1G139 Datasheet, PDF (1/10 Pages) Texas Instruments – 2-TO -4 LINE DECODER

SN74LVC1G139
2ĆTOĆ4 LINE DECODER
D Available in the Texas Instruments
NanoStar and NanoFree Packages
D Supports 5-V V_CC Operation
D Inputs Accept Voltages to 5.5 V
D Max t_pd of 4.9 ns at 3.3 V
D Low Power Consumption, 10-µA Max I_CC
D ±24-mA Output Drive at 3.3 V
D I_off Supports Partial-Power-Down Mode
Operation
D Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
SCES602 − AUGUST 2004
DCT OR DCU PACKAGE
(TOP VIEW)
A1
B2
Y3 3
GND 4
8 V_CC
7 Y0
6 Y1
5 Y2
YEP OR YZP PACKAGE
(BOTTOM VIEW)
GND 4 5 Y2
Y3 3 6 Y1
B 2 7 Y0
A 1 8 V_CC
description/ordering information
This 2-to-4 line decoder is designed for 1.65-V to 5.5-V V_CC operation.
The SN74LVC1G139 2-line to 4-line decoder is designed to be used in high-performance memory-decoding
or data-routing applications requiring very short propagation delay times. In high-performance memory
systems, this decoder can be used to minimize the effects of system decoding. When used with high-speed
memories utilizing a fast enable circuit, the delay times of these decoders and the enable time of the memory
usually are less than the typical access time of the memory. This means that the effective system delay
introduced by the decoder is negligible.
NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
−40°C to 85°C
NanoStar − WCSP (DSBGA)
0.23-mm Large Bump − YEP
NanoFree − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
SSOP − DCT
Reel of 3000
Reel of 3000
Reel of 250
SN74LVC1G139YEPR
SN74LVC1G139YZPR
SN74LVC1G139DCTR
SN74LVC1G139DCTT
_ _ _C9_
C39_ _ _
VSSOP − DCU
Reel of 3000
Reel of 250
SN74LVC1G139DCUR
SN74LVC1G139DCUT
C39_
† _{Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at}
www.ti.com/sc/package.
‡ _{DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.}
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright  2004 Texas Instruments Incorporated
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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