SN74LVC1G06 Datasheet, PDF (1/12 Pages) Texas Instruments – SINGLE INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT

D Available in the Texas Instruments
NanoStar and NanoFree Packages
D Supports 5-V V_CC Operation
D Input and Open-Drain Output Accept
Voltages Up To 5.5 V
D Max t_pd of 4 ns at 3.3 V
D Low Power Consumption, 10-µA Max I_CC
D ±24-mA Output Drive at 3.3 V
D I_off Supports Partial-Power-Down Mode
Operation
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
SN74LVC1G06
SINGLE INVERTER BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUT
SCES295N – JUNE 2000 – REVISED SEPTEMBER 2003
DBV OR DCK PACKAGE
(TOP VIEW)
NC ¹
A²
GND ³
5 V_CC
4Y
NC – No internal connection
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
GND 3 4 Y
A2
DNU 1 5 V_CC
DNU – Do not use
description/ordering information
This single inverter buffer/driver is designed for 1.65-V to 5.5-V V_CC operation.
NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
The output of the SN74LVC1G06 device is open drain and can be connected to other open-drain outputs to
implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
NanoStar – WCSP (DSBGA)
0.17-mm Small Bump – YEA
SN74LVC1G06YEAR
–40°C to 85°C
NanoFree – WCSP (DSBGA)
0.17-mm Small Bump – YZA (Pb-free)
NanoStar – WCSP (DSBGA)
0.23-mm Large Bump – YEP
NanoFree – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
Reel of 3000
SN74LVC1G06YZAR
SN74LVC1G06YEPR
SN74LVC1G06YZPR
_ _ _CT_
SOT (SOT-23) – DBV
Reel of 3000
Reel of 250
SN74LVC1G06DBVR
SN74LVC1G06DBVT
C06_
SOT (SC-70) – DCK
Reel of 3000 SN74LVC1G06DCKR
CT_
Reel of 250
SN74LVC1G06DCKT
† _{Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at}
www.ti.com/sc/package.
‡ _{DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.}
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright  2003, Texas Instruments Incorporated
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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