SN74LVC1404 Datasheet, PDF (1/16 Pages) Texas Instruments – OSCILLATOR DRIVER FOR CRYSTAL OSCILLATOR OR CERAMIC RESONATOR

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SN74LVC1404
OSCILLATOR DRIVER
FOR CRYSTAL OSCILLATOR OR CERAMIC RESONATOR
SCES469C – AUGUST 2003 – REVISED JULY 2005
FEATURES
• Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
• Supports 5-V V_CC Operation
• Inputs Accept Voltages to 5.5 V
• One Buffered Inverter With Schmitt-Trigger
Input and Two Unbuffered Inverters
• Integrated Solution for Oscillator Applications
• Suitable for Commonly Used Clock
Frequencies:
– 15 kHz, 3.58 MHz, 4.43 MHz, 13 MHz,
25 MHz, 26 MHz, 27 MHz, 28 MHz
• Control Input to Disable the Oscillator Circuit
• Low Power Consumption (10-µA Max I_CC) in
Standby State
• ±24-mA Output Drive at 3.3 V
• I_off Supports Partial-Power-Down Mode
Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
CTRL
XOUT
XIN
GND
DCT PACKAGE
(TOP VIEW)
1
8
2
7
3
6
4
5
V_CC
OSCOUT
A
CTRL
XOUT
XIN
GND
Y
DCU PACKAGE
(TOP VIEW)
1
8
2
7
3
6
4
5
YEP OR YZP PACKAGE
(BOTTOM VIEW)
V_CC
OSCOUT
A
Y
GND
XIN
XOUT
CTRL
45 Y
36 A
2 7 OSCOUT
1 8 _VCC
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This device consists of one inverter with a Schmitt-trigger input and two unbuffered inverters. It is designed for
1.65-V to 5.5-V V_CC operation.
ORDERING INFORMATION
T_A
–40°C to 85°C
PACKAGE ⁽¹⁾
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP
(Pb-free)
ORDERABLE PART NUMBER
Tape and reel
SN74LVC1404YEPR
SN74LVC1404YZPR
SSOP – DCT
Tape and reel SN74LVC1404DCTR
VSSOP – DCU
Tape and reel SN74LVC1404DCUR
TOP-SIDE MARKING⁽²⁾
_ _ _44_
CA4_ _ _
CA4_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2005, Texas Instruments Incorporated