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SN74HC138_101 Datasheet, PDF (1/22 Pages) Texas Instruments – 3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS
SN54HC138, SN74HC138
3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS
D Targeted Specifically for High-Speed
Memory Decoders and Data-Transmission
Systems
D Wide Operating Voltage Range of 2 V to 6 V
D Outputs Can Drive Up To 10 LSTTL Loads
D Low Power Consumption, 80-μA Max ICC
D Typical tpd = 15 ns
D ±4-mA Output Drive at 5 V
D Low Input Current of 1 μA Max
D Incorporate Three Enable Inputs to Simplify
Cascading and/or Data Reception
description/ordering information
The ’HC138 devices are designed to be used in
high-performance memory-decoding or data-
routing applications requiring very short
propagation delay times. In high-performance
memory systems, these decoders can be used to
minimize the effects of system decoding. When
employed with high-speed memories utilizing a
fast enable circuit, the delay times of these
decoders and the enable time of the memory are
usually less than the typical access time of the
memory. This means that the effective system
delay introduced by the decoders is negligible.
SCLS107E − DECEMBER 1982 − REVISED SEPTEMBER 2003
SN54HC138 . . . J OR W PACKAGE
SN74HC138 . . . D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
A1
B2
C3
G2A 4
G2B 5
G1 6
Y7 7
GND 8
16 VCC
15 Y0
14 Y1
13 Y2
12 Y3
11 Y4
10 Y5
9 Y6
SN54HC138 . . . FK PACKAGE
(TOP VIEW)
C
3 2 1 20 19
4
18
Y1
G2A 5
17 Y2
NC 6
16 NC
G2B 7
15 Y3
G1 8
14 Y4
9 10 11 12 13
NC − No internal connection
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
PDIP − N
Tube of 25
SN74HC138N
SN74HC138N
Tube of 40
SN74HC138D
SOIC − D
Reel of 2500
Reel of 250
SN74HC138DR
SN74HC138DT
HC138
−40°C to 85°C
SOP − NS
SSOP − DB
Reel of 2000
Reel of 2000
SN74HC138NSR
SN74HC138DBR
HC138
HC138
Tube of 90
SN74HC138PW
TSSOP − PW
Reel of 2000
Reel of 250
SN74HC138PWR
SN74HC138PWT
HC138
CDIP − J
Tube of 25
SNJ54HC138J
SNJ54HC138J
−55°C to 125°C CFP − W
Tube of 150
SNJ54HC138W
SNJ54HC138W
LCCC − FK
Tube of 55
SNJ54HC138FK
SNJ54HC138FK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Copyright © 2003, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
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