SN74HC138QDRG4Q1 Datasheet, PDF (1/14 Pages) Texas Instruments – 3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS

SN74HC138-Q1
3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS
D Qualified for Automotive Applications
D ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
D Targeted Specifically for High-Speed
Memory Decoders and Data-Transmission
Systems
D 2-V to 6-V V_CC Operation
D Outputs Can Drive Up To 10 LSTTL Loads
D Low Power Consumption, 80-µA Max I_CC
D Typical t_pd = 15 ns
D ±4-mA Output Drive at 5 V
D Low Input Current of 1 µA Max
D Incorporate Three Enable Inputs to Simplify
Cascading and/or Data Reception
SCLS533A − AUGUST 2003 − REVISED SEPTEMBER 2008
D OR PW PACKAGE
(TOP VIEW)
A₁
B2
C3
G2A 4
G2B 5
G1 6
Y7 7
GND 8
16 ^VCC
15 Y0
14 Y1
13 Y2
12 Y3
11 Y4
10 Y5
9 Y6
description/ordering information
The SN74HC138 is designed to be used in high-performance memory-decoding or data-routing applications
requiring very short propagation delay times. In high-performance memory systems, this decoder can be used
to minimize the effects of system decoding. When employed with high-speed memories utilizing a fast enable
circuit, the delay times of this decoder and the enable time of the memory usually are less than the typical access
time of the memory. This means that the effective system delay introduced by the decoders is negligible.
The conditions at the binary-select inputs at the three enable inputs select one of eight output lines. Two
active-low and one active-high enable inputs reduce the need for external gates or inverters when expanding.
A 24-line decoder can be implemented without external inverters, and a 32-line decoder requires only one
inverter. An enable input can be used as a data input for demultiplexing applications.
ORDERING INFORMATION^{
T_A
PACKAGE^‡
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
SOIC − D
−40°C to 125°C
TSSOP − PW
Tape and reel
Tape and reel
SN74HC138QDRQ1
SN74HC138QPWRQ1
HC138Q1
HC138Q1
† _{For the most current package and ordering information, see the Package Option Addendum at the end of this}
document, or see the TI web site at www.ti.com.
‡ _{Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.}
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Copyright  2008, Texas Instruments Incorporated
1