SN74CBTLV3126_04 Datasheet, PDF (1/11 Pages) Texas Instruments – LOW-VOLTAGE QUADRUPLE FET BUS SWITCH

SN74CBTLV3126
LOWĆVOLTAGE QUADRUPLE FET BUS SWITCH
D Standard ’126-Type Pinout
D 5-Ω Switch Connection Between Two Ports
D Rail-to-Rail Switching on Data I/O Ports
SCDS038I − DECEMBER 1997 − REVISED OCTOBER 2003
D I_off Supports Partial-Power-Down Mode
Operation
D Latch-up Performance Exceeds 100 mA per
JESD 78, Class II
D, DGV, OR PW PACKAGE
(TOP VIEW)
1OE 1
1A 2
1B 3
2OE 4
2A 5
2B 6
GND 7
14 V_CC
13 4OE
12 4A
11 4B
10 3OE
9 3A
8 3B
RGY PACKAGE
(TOP VIEW)
1
1A 2
1B 3
2OE 4
2A 5
2B 6
7
14
13 4OE
12 4A
11 4B
10 3OE
9 3A
8
DBQ PACKAGE
(TOP VIEW)
NC 1
1OE 2
1A 3
1B 4
2OE 5
2A 6
2B 7
GND 8
16 V_CC
15 4OE
14 4A
13 4B
12 3OE
11 3A
10 3B
9 NC
NC − No internal connection
description/ordering information
The SN74CBTLV3126 quadruple FET bus switch features independent line switches. Each switch is disabled
when the associated output-enable (OE) input is low.
This device is fully specified for partial-power-down applications using I_off. The I_off feature ensures that
damaging current will not backflow through the device when it is powered down. The device has isolation during
power off.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a
pulldown resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
QFN − RGY
Tape and reel SN74CBTLV3126RGYR CL126
−40°C to 85°C
SOIC − D
SSOP (QSOP) − DBQ
Tube
Tape and reel
Tape and reel
SN74CBTLV3126D
SN74CBTLV3126DR
SN74CBTLV3126DBQR
CBTLV3126
CL126
TSSOP − PW
Tape and reel SN74CBTLV3126PWR CL126
TVSOP − DGV
Tape and reel SN74CBTLV3126DGVR CL126
† _{Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines}
are available at www.ti.com/sc/package.
FUNCTION TABLE
(each bus switch)
INPUT
OE
FUNCTION
L
Disconnect
H
A port = B port
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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Copyright  2003, Texas Instruments Incorporated
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