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SN74CB3Q3345_05 Datasheet, PDF (1/17 Pages) Texas Instruments – 8-BIT FET BUS SWITCH 2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH
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SN74CB3Q3345
8-BIT FET BUS SWITCH
2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH
SCDS144B – OCTOBER 2003 – REVISED MARCH 2005
FEATURES
• High-Bandwidth Data Path (up to 500 MHz (1))
• 5-V-Tolerant I/Os With Device Powered Up or
Powered Down
• Low and Flat ON-State Resistance (ron)
Characteristics Over Operating Range
(ron = 4 Ω Typ)
• Rail-to-Rail Switching on Data I/O Ports
– 0- to 5-V Switching With 3.3-V VCC
– 0- to 3.3-V Switching With 2.5-V VCC
• Bidirectional Data Flow With Near-Zero
Propagation Delay
• Low Input/Output Capacitance Minimizes
Loading and Signal Distortion
(Cio(OFF) = 4 pF Typ)
• Fast Switching Frequency (fOE = 20 MHz Max)
(1) For additional information regarding the performance
characteristics of the CB3Q family, refer to the TI application
report, CBT-C, CB3T, and CB3Q Signal-Switch Families,
literature number SCDA008.
• Data and Control Inputs Provide Undershoot
Clamp Diodes
• Low Power Consumption (ICC = 0.7 mA Typ)
• VCC Operating Range From 2.3 V to 3.6 V
• Data I/Os Support 0- to 5-V Signaling Levels
(0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V)
• Control Inputs Can Be Driven by TTL or
5-V/3.3-V CMOS Outputs
• Ioff Supports Partial-Power-Down Mode
Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
• Supports Both Digital and Analog
Applications: Differential Signal Interface,
Memory Interleaving, Bus Isolation,
Low-Distortion Signal Gating
DBQ, DGV, OR PW PACKAGE
(TOP VIEW)
RGY PACKAGE
(TOP VIEW)
OE 1
A1 2
A2 3
A3 4
A4 5
A5 6
A6 7
A7 8
A8 9
GND 10
20 VCC
19 OE
18 B1
17 B2
16 B3
15 B4
14 B5
13 B6
12 B7
11 B8
1
A1 2
A2 3
A3 4
A4 5
A5 6
A6 7
A7 8
A8 9
10
20
19 OE
18 B1
17 B2
16 B9
15 B4
14 B5
13 B6
12 B7
11
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2005, Texas Instruments Incorporated