SN74AVCH1T45DCKT Datasheet, PDF (1/34 Pages) Texas Instruments – SINGLE-BIT DUAL-SUPPLY BUS TRANSCEIVER WITH CONFIGURABLE VOLTAGE TRANSLATION ND 3-STATE OUTPUTS

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SN74AVCH1T45
SINGLE-BIT DUAL-SUPPLY BUS TRANSCEIVER
WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS
SCES598D – JULY 2004 – REVISED JANUARY 2008
FEATURES
1
•2 Available in the Texas Instruments NanoStar™
and NanoFree™ Packages
• Control Inputs V_IH/V_IL Levels Are Referenced to
V_CCA Voltage
• Fully Configurable Dual-Rail Design Allows
Each Port to Operate Over the Full 1.2-V to
3.6-V Power-Supply Range
• I/Os Are 4.6-V Tolerant
• I_off Supports Partial-Power-Down Mode
Operation
• Bus Hold on Data Inputs Eliminates the Need
for External Pullup/Pulldown Resistors
• Typical Max Data Rates
– 380 Mbps (1.8-V to 3.3-V Translation)
– 200 Mbps (<1.8-V to 3.3-V Translation)
– 200 Mbps (Translate to 2.5 V or 1.8 V)
– 150 Mbps (Translate to 1.5 V)
– 100 Mbps (Translate to 1.2 V)
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DBV OR DCK PACKAGE
(TOP VIEW)
V_CCA 1
GND 2
A3
6 V_CCB
5 DIR
4B
YEP OR YZP PACKAGE
(BOTTOM VIEW)
A 34 B
GND 2 5 DIR
V_CCA 1 6 V_CCB
DESCRIPTION/ORDERING INFORMATION
This single-bit noninverting bus transceiver uses two separate configurable power-supply rails. The A port is
designed to track V_CCA. V_CCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track
V_CCB. V_CCB accepts any supply voltage from 1.2 V to 3.6 V. This allows for universal low-voltage bidirectional
translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V voltage nodes.
The SN74AVCH1T45 is designed for asynchronous communication between data buses. The device transmits
data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the
direction-control (DIR) input.
The SN74AVCH1T45 is designed so that the DIR input is powered by V_CCA.
ORDERING INFORMATION
T_A
–40°C to 85°C
PACKAGE ⁽¹⁾
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SOT (SOT-23) – DBV
Tape and reel
Tape and reel
ORDERABLE PART NUMBER TOP-SIDE MARKING⁽²⁾
SN74AVCH1T45YZPR
_ _ _TF_
SN74AVCH1T45DBVR
ET1_
SOT (SC-70) – DCK
Tape and reel
SN74AVCH1T45DCKR
TF_
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2008, Texas Instruments Incorporated