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SN74AVC2T872_1 Datasheet, PDF (1/18 Pages) Texas Instruments – VOLTAGE-LEVEL SHIFTER FOR IC-USB INTERFACE
SN74AVC2T872
www.ti.com........................................................................................................................................................................................... SCES710 – NOVEMBER 2008
VOLTAGE-LEVEL SHIFTER FOR IC-USB INTERFACE
FEATURES
1
• VCCA, VCCB Supply Voltage: 1.1 V to 3.6 V
• When VCCB = 0 V, A-Port is Disabled and
B-Port is Held at GND Through 120-kΩ
Pulldown
• Crossover Skew of <1 ns
• Meets All Requirements of the IC-USB
Standard
• Small Package: 0.4 mm pitch WCSP
(1.2 mm × 1.6 mm)
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II ESD Performance
– A-Port (Host Side)
– 2000-V Human-Body Model
– 1000-V Charged-Device Model
– B-Port (Peripheral Side)
– 8000-V Contact Discharge
– 15000-V Air-Gap Discharge
YFP PACKAGE
(TOP VIEW)
12 3
A
B
C
D
1
2
3
A
PD_EN
VCCA
VCCB
B
D+(A)
VCCA
D+(B)
C
D–(A)
GND
D–(B)
D
DIR
GND
DIR_POL
DESCRIPTION/ORDERING INFORMATION
The SN74AVC2T872 is a 2-bit voltage level translator optimized for use in interchip USB (IC-USB) applications.
VCCA and VCCB can each operate over the full range of 1.1 V to 3.6 V. The device has been designed to maintain
crossover skew to be less than 1 ns. Each B-port has an integrated 120-kΩ pulldown resistor that can be
enabled and disabled using the PD_EN control signal. If VCCB = 0 V, the A-port I/Os are disabled (Hi-Z) and the
B-port I/Os are held to GND through the 120-kΩ resistors. If VCCA = 0 V, the A-port and B-port I/Os are disabled
(Hi-Z).
TA
–40°C to 85°C
ORDERING INFORMATION
PACKAGE (1) (2)
ORDERABLE PART NUMBER
WCSP – YFP
Reel of 3000
SN74AVC2T872YFPR
TOP-SIDE MARKING(3)
_ _ _ TU _
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) YFP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
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