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SN74AVC2T45 Datasheet, PDF (1/21 Pages) Texas Instruments – DUAL BIT DUAL SUPPLY BUS TRANSCEIVER WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3 STATE OUTPUTS
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SN74AVC2T45
DUAL-BIT DUAL-SUPPLY BUS TRANSCEIVER
WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS
SCES531F – DECEMBER 2003 – REVISED MAY 2005
FEATURES
• Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
• Control Inputs VIH/VIL Levels Are Referenced
to VCCA Voltage
• Fully Configurable Dual-Rail Design Allows
Each Port to Operate Over the Full 1.2-V to
3.6-V Power-Supply Range
• I/Os Are 4.6-V Tolerant
• Ioff Supports Partial-Power-Down Mode
Operation
BBBB
BBBB
BBBB
• Max Data Rates
– 500 Mbps (1.8-V to 3.3-V Translation)
– 320 Mbps (<1.8-V to 3.3-V Translation)
– 320 Mbps (Translate to 2.5 V or 1.8 V)
– 180 Mbps (Translate to 1.5 V)
– 240 Mbps (Translate to 1.2 V)
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DCT OR DCU PACKAGE
(TOP VIEW)
YEP OR YZP PACKAGE
(BOTTOM VIEW)
VCCA 1
A1 2
A2 3
GND 4
8 VCCB
7 B1
6 B2
5 DIR
GND 4 5 DIR
A2 3 6 B2
A1 2 7 B1
VCCA 1 8 VCCB
DESCRIPTION/ORDERING INFORMATION
This dual-bit noninverting bus transceiver uses two separate configurable power-supply rails. The A port is
designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track
VCCB. VCCB accepts any supply voltage from 1.2 V to 3.6 V. This allows for universal low-voltage bidirectional
translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V voltage nodes.
The SN74AVC2T45 is designed for asynchronous communication between data buses. The device transmits
data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the
direction-control (DIR) input.
The SN74AVC2T45 is designed so that the DIR input is powered by VCCA.
ORDERING INFORMATION
TA
PACKAGE (1)
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
NanoFree™ – WCSP (DSBGA)
–40°C to 85°C 0.23-mm Large Bump – YZP (Pb-free)
Tape and reel
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)
SN74AVC2T45YEPR
SN74AVC2T45YZPR
_ _ _TD_
SSOP – DCT
Tape and reel
SN74AVC2T45DCTR
DT2_ _ _
VSSOP – DCU
Tape and reel
SN74AVC2T45DCUR
DT2_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, ⋅ = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2005, Texas Instruments Incorporated