SN74AVC16374_06 Datasheet, PDF (1/18 Pages) Texas Instruments – 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS

www.ti.com
FEATURES
• Member of the Texas Instruments Widebus™
Family
• EPIC™ (Enhanced-Performance Implanted
CMOS) Submicron Process
• DOC™ (Dynamic Output Control) Circuit
Dynamically Changes Output Impedance,
Resulting in Noise Reduction Without Speed
Degradation
• Dynamic Drive Capability Is Equivalent to
Standard Outputs With I_OH and I_OL of ±24 mA
at 2.5-V V_CC
SN74AVC16374
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH 3-STATE OUTPUTS
SCES158H – DECEMBER 1998 – REVISED MARCH 2005
• Overvoltage-Tolerant Inputs/Outputs Allow
Mixed-Voltage-Mode Data Communications
• I_off Supports Partial-Power-Down Mode
Operation
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• Package Options Include Plastic Thin Shrink
Small-Outline (DGG) and Thin Very
Small-Outline (DGV) Packages
DESCRIPTION/ORDERING INFORMATION
A Dynamic Output Control (DOC) circuit is implemented, which, during the transition, initially lowers the output
impedance to effectively drive the load and, subsequently, raises the impedance to reduce noise. Figure 1 shows
typical V_OL vs I_OL and V_OH vs I_OH curves to illustrate the output impedance and drive capability of the circuit. At
the beginning of the signal transition, the DOC circuit provides a maximum dynamic drive that is equivalent to a
high-drive standard-output device. For more information, refer to the TI application reports, AVC Logic Family
Technology and Applications, literature number SCEA006, and Dynamic Output Control (DOC) Circuitry
Technology and Applications, literature number SCEA009.
T_A
–40°C to 85°C
ORDERING INFORMATION
PACKAGE ⁽¹⁾
ORDERABLE PART NUMBER
TSSOP – DGG
Tape and reel
SN74AVC16374DGGR
TVSOP – DGV
Tape and reel
SN74AVC16374DGVR
VFBGA – GQL
Tape and reel
SN74AVC16374GQLR
TOP-SIDE MARKING
AVC16374
CVA374
CVA374
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
3.2 _{TA = 25°C}
2.8 ^{Process = Nominal}
2.4
2.0
V_CC = 3.3 V
T_A = 25°C
2.8 Process = Nominal
2.4
2.0
1.6
V_CC = 2.5 V
1.2
V_CC = 1.8 V
0.8
0.4
0 17 34 51 68 85 102 119 136 153 170
I_OL − Output Current − mA
1.6
1.2
0.8
V_CC = 3.3 V
0.4
V_CC = 2.5 V
V_CC = 1.8 V
−160 −144 −128 −112 −96 −80 −64 −48 −32 −16 0
I_OH − Output Current − mA
Figure 1. Output Voltage vs Output Current
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus, EPIC, DOC are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1998–2005, Texas Instruments Incorporated