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SN74AUP2G125 Datasheet, PDF (1/21 Pages) Texas Instruments – LOW-POWER DUAL BUS BUFFER GATE WITH 3-STATE OTPUTS
SN74AUP2G125
www.ti.com
SCES688D – JANUARY 2007 – REVISED MAY 2010
LOW-POWER DUAL BUS BUFFER GATE WITH 3-STATE OUTPUTS
Check for Samples: SN74AUP2G125
FEATURES
1
• Available in the Texas Instruments NanoStar™
Package
• Low Static-Power Consumption
(ICC = 0.9 mA Max)
• Low Dynamic-Power Consumption
(Cpd = 4 pF Typ at 3.3 V)
• Low Input Capacitance (CI = 1.5 pF Typ)
• Low Noise – Overshoot and Undershoot
<10% of VCC
• Input-Disable Feature Allows Floating Input
Conditions
• Ioff Supports Partial-Power-Down Mode
Operation
• Input Hysteresis Allows Slow Input Transition
and Better Switching Noise Immunity at Input
• Wide Operating VCC Range of 0.8 V to 3.6 V
• Optimized for 3.3-V Operation
• 3.6-V I/O Tolerant to Support Mixed-Mode
Signal Operation
• tpd = 5.4 ns Max at 3.3 V
• Suitable for Point-to-Point Applications
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
1OE
1A
2Y
GND
DCU PACKAGE
(TOP VIEW)
1
8
2
7
3
6
4
5
VCC
2OE
1Y
2A
DQE PACKAGE
(TOP VIEW)
1OE 1
1A 2
2Y 3
GND 4
V 8
CC
7 2OE
6 1Y
5 2A
RSE PACKAGE
(TOP VIEW)
V
CC
2OE 1 8 7 1OE
1Y 2
6 1A
2A 3 4 5 2Y
YFP OR YZP PACKAGE
(TOP VIEW)
1OE
1A
2Y
GND
A1 1 8 A2
B1 2 7 B2
C1 3 6 C2
D1 4 5 D2
VCC
2OE
1Y
2A
GND
The exposed center pad, if used, must be connected
only as a secondary GND or left electrically open.
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable
applications. This family ensures a very low static and dynamic power consumption across the entire VCC range
of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see
Figure 1 and Figure 2).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2010, Texas Instruments Incorporated