SN74AUP1G57_07 Datasheet, PDF (1/18 Pages) Texas Instruments – LOW-POWER CONFIGURABLE MULTIPLE-FUNCTION GATE

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SN74AUP1G57
LOW-POWER CONFIGURABLE MULTIPLE-FUNCTION GATE
SCES503G – NOVEMBER 2003 – REVISED APRIL 2007
FEATURES
• Available in the Texas Instruments
NanoFree™ Packages
• Low Static-Power Consumption
(I_CC = 0.9 µA Max)
• Low Dynamic-Power Consumption
(C_pd = 4.3 pF Typ at 3.3 V)
• Low Input Capacitance (C_i = 1.5 pF Typ)
• Low Noise – Overshoot and Undershoot
<10% of V_CC
• I_off Supports Partial-Power-Down Mode
Operation
• Includes Schmitt-Trigger Inputs
• Wide Operating V_CC Range of 0.8 V to 3.6 V
• Optimized for 3.3-V Operation
• 3.6-V I/O Tolerant to Support Mixed-Mode
Signal Operation
• t_pd = 5.3 ns Max at 3.3 V
• Suitable for Point-to-Point Applications
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
• ESD Protection Exceeds ±5000 V With
Human-Body Model
In1
GND
In0
In1
In2
GND
In0
In2 In1
In2
GND
In0
DRY PACKAGE
(TOP VIEW)
GN_IInnD_0P¹ _R32E^{1 VIE}₄₆₅ ^WIVYn_C²_C
YZP PACKAGE
(BOTTOM VIEW)
In0
GND
In1
In2
YFP PACKAGE
(BOTTOM VIEW)
GN_IInnD_P10REVIEIn^W₂
DESCRIPTION/ORDERING INFORMATION
The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable
applications. This family ensures a very low static and dynamic power consumption across the entire V_CC range
of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity,
which produces very low undershoot and overshoot characteristics.
The SN74AUP1G57 features configurable multiple functions. The output state is determined by eight patterns of
3-bit input. The user can choose the logic functions AND, OR, NAND, NOR, XNOR, inverter, and noninverter. All
inputs can be connected to V_CC or GND.
The device functions as an independent gate with Schmitt-trigger inputs, which allow for slow input transition
and better switching noise immunity at the input.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2007, Texas Instruments Incorporated