SN74AUP1G32_10 Datasheet, PDF (1/22 Pages) Texas Instruments – LOW-POWER SINGLE 2-INPUT POSITIVE-OR GATE

SN74AUP1G32
www.ti.com
SCES580F – JUNE 2004 – REVISED MARCH 2010
LOW-POWER SINGLE 2-INPUT POSITIVE-OR GATE
Check for Samples: SN74AUP1G32
FEATURES
1
• Available in the Texas Instruments NanoStar™
Package
• Low Static-Power Consumption
(I_CC = 0.9 mA Max)
• Low Dynamic-Power Consumption
(C_pd = 4.3 pF Typ at 3.3 V)
• Low Input Capacitance (C_I = 1.5 pF Typ)
• Low Noise – Overshoot and Undershoot
<10% of V_CC
• I_off Supports Partial-Power-Down Mode
Operation
• Input Hysteresis Allows Slow Input Transition
and Better Switching Noise Immunity at the
Input (V_hys = 250 mV Typ at 3.3 V)
• Wide Operating V_CC Range of 0.8 V to 3.6 V
• Optimized for 3.3-V Operation
• 3.6-V I/O Tolerant to Support Mixed-Mode
Signal Operation
• t_pd = 4.6 ns Max at 3.3 V
• Suitable for Point-to-Point Applications
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
DBV PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
DRL PACKAGE
(TOP VIEW)
A
1
B
2
5
V_CC
A
1
5
V_CC
B
2
A1
B2
5 V_CC
GND
3
4Y
GND 3
4Y
GND
3
4
Y
DRY PACKAGE
(TOP VIEW)
DSF PACKAGE
(TOP VIEW)
A¹
B²
GND ³
6 V_CC
5 _N.C.
A¹
B²
4Y
GND ³
6 _VCC
5 _N.C.
4_Y
DNU – Do not use
NC – No internal connection
See mechanical drawings for dimensions.
YZP PACKAGE
(TOP VIEW)
YFP PACKAGE
(TOP VIEW)
A V A1 1 5 A2
CC
B B1 2
GND C1 3 ⁴ C2 Y
A V A1 1 6 A2
CC
B B1 2 5 B2 DNU
GND C1 3 ⁴ C2 Y
DESCRIPTION/ORDERING INFORMATION
The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable
applications. This family ensures a very low static and dynamic power consumption across the entire V_CC range
of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity (see
Figure 1 and Figure 2).
This single 2-input positive-OR gate performs the Boolean function ^{Y + A ) B or Y + A • B} in positive logic.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
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Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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