SN74AUP1G240_10 Datasheet, PDF (1/21 Pages) Texas Instruments – LOW-POWER SINGLE BUFFER/DRIVER WITH 3-STATE OUTPUT

SN74AUP1G240
www.ti.com
SCES627C – MARCH 2005 – REVISED MAY 2010
LOW-POWER SINGLE BUFFER/DRIVER WITH 3-STATE OUTPUT
Check for Samples: SN74AUP1G240
FEATURES
1
• Available in the Texas Instruments NanoStar™
Package
• Low Static-Power Consumption
– I_CC = 0.9 mA Max
• Low Dynamic-Power Consumption
– C_pd = 4.2 pF at 3.3 V Typ
• Low Input Capacitance
– C_I = 1.5 pF Typ
• Low Noise – Overshoot and Undershoot
<10% of V_CC
• Input-Disable Feature Allows Floating Input
Conditions
• I_off Supports Partial Power-Down-Mode
Operation
DBV PACKAGE
(TOP VIEW)
• Input Hysteresis Allows Slow Input Transition
and Better Switching Noise Immunity at the
Input
• Wide Operating V_CC Range of 0.8 V to 3.6 V
• Optimized for 3.3-V Operation
• 3.6-V I/O Tolerant to Support Mixed-Mode
Signal Operation
• t_pd = 4.7 ns Max at 3.3 V
• Suitable for Point-to-Point Applications
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
DCK PACKAGE
(TOP VIEW)
OE
1
A
2
5
V_CC
OE
1
5
V_CC
A
2
GND
3
4Y
GND
3
4
Y
DRY PACKAGE
(TOP VIEW)
OE ¹
A²
GND ³
6 V_CC
5 _NC
4Y
DSF PACKAGE
(TOP VIEW)
OE ¹
A²
6 _VCC
5 _N.C.
GND ³
4_Y
YFP PACKAGE
(TOP VIEW)
OE V A1 1 6 ^A2
CC
A B1 2 5 B2 N.C.
GND C1 3 ⁴ C2 Y
YZP PACKAGE
(TOP VIEW)
OE V A1 1 5 ^A2
CC
A B1 2
GND C1 3 ⁴ C2 Y
See mechanical drawings for dimensions.
N.C. – No internal connection
DESCRIPTION/ORDERING INFORMATION
The AUP family is TI's premier solution to the industry's low power needs in battery-powered portable
applications. This family ensures a very low static and dynamic power consumption across the entire V_CC range
of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see
Figure 1 and Figure 2).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2010, Texas Instruments Incorporated