SN74AUP1G14 Datasheet, PDF (1/11 Pages) Texas Instruments – LOW POWER SINGLE SCHMITT TRIGGER INVERTER

SN74AUP1G14
LOWĆPOWER SINGLE SCHMITTĆTRIGGER INVERTER
D Available in the Texas Instruments
NanoStar and NanoFree Packages
D Low Static-Power Consumption;
I_CC = 0.9-µA Max
D Low Dynamic-Power Consumption;
C_pd = 4.4 pF Typical at 3.3 V
D Low Input Capacitance; C_i = 1.5 pF Typical
D Low Noise − Overshoot and Undershoot
<10% of V_CC
D I_off Supports Partial-Power-Down Mode
Operation
D Includes Schmitt-Trigger Inputs
D Wide Operating V_CC Range of 0.8 V to 3.6 V
D Optimized for 3.3-V Operation
SCES578 – JUNE 2004
D 3.6-V I/O Tolerant to Support Mixed-Mode
Signal Operation
D t_pd = 4.9 ns Max at 3.3 V
D Suitable for Point-to-Point Applications
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Performance Tested Per JESD 22
− 2000-V Human-Body Model
(A114-B, Class II)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
D ESD Protection Exceeds ±5000-V With
Human-Body Model
DBV OR DCK PACKAGE
(TOP VIEW)
YEP OR YZP PACKAGE
(BOTTOM VIEW)
NC 1
A2
GND 3
5 V_CC
4Y
GND 3 4 Y
A2
DNU 1 5 V_CC
NC − No internal connection
description /ordering information
DNU − Do not use
The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable
applications. This family ensures a very low static and dynamic power consumption across the entire V_CC range
of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see
Figures 1 and 2).
Static-Power Consumption
Dynamic-Power Consumption
100%
(µA)
(pF)
100%
80%
80%
60%
40%
3.3-V
Logic^†
60%
40%
3.3-V
L^Lo^Vg^Cic^†
20%
0%
AUP
20%
0%
AUP
† _{Single, dual, and triple gates.}
Figure 1. AUP−The Lowest-Power Family
Switching Characteristics
at 25 MHz†
3.5
3
2.5
2 ^Input
Output
1.5
1
0.5
0
−0.5 _{0 5 10 15 20 25 30 35 40 45}
Time − ns
† _{AUP1G08 data at CL = 15 pF.}
Figure 2. Excellent Signal Integrity
This device functions as an independent gate with Schmitt-trigger inputs, which allows for slow input transition
and better switching-noise immunity at the input.
NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright  2004, Texas Instruments Incorporated
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