SN74AUP1G07_10 Datasheet, PDF (1/21 Pages) Texas Instruments – LOW-POWER SINGLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS

SN74AUP1G07
www.ti.com
SCES591F – JULY 2004 – REVISED MAY 2010
LOW-POWER SINGLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS
Check for Samples: SN74AUP1G07
FEATURES
1
• Available in the Texas Instruments NanoStar™
Package
• Low Static-Power Consumption
(I_CC = 0.9 mA Maximum)
• Low Dynamic-Power Consumption
(C_pd = 1 pF Typical at 3.3 V)
• Low Input Capacitance (C_i = 1.5 pF Typical)
• Low Noise – Overshoot and Undershoot
<10% of V_CC
• I_off Supports Partial-Power-Down Mode
Operation
• Input Hysteresis Allows Slow Input Transition
and Better Switching Noise Immunity at the
Input (V_hys = 250 mV Typ at 3.3 V)
• Wide Operating V_CC Range of 0.8 V to 3.6 V
• Optimized for 3.3-V Operation
• 3.6-V I/O Tolerant to Support Mixed-Mode
Signal Operation
• t_pd = 3.3 ns Maximum at 3.3 V
• Suitable for Point-to-Point Applications
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
DBV PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
DRL PACKAGE
(TOP VIEW)
N.C.
1
A
2
5
V
N.C.
1
5
V
CC
N.C. 1
5V
CC
CC
A
2
A2
GND 3
4Y
GND
3
4
Y
GND
3
4
Y
DRY PACKAGE
(TOP VIEW)
N.C. ¹
A²
GND ³
6V
CC
5 _N.C.
4Y
DSF PACKAGE
(TOP VIEW)
N.C. ¹
A²
6V
CC
5 _N.C.
GND ³
4_Y
YFP PACKAGE
(TOP VIEW)
A V A1 1 4 A2
CC
GND B1 2 3 B2 Y
YZP PACKAGE
(TOP VIEW)
DNU A1 1 5 A2 V
CC
A B1 2
GND C1 3 ⁴ C2 Y
N.C. – No internal connection.
DNU – Do not use
See mechancial drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
The AUP family is TI's premier solution to the industry's low power needs in battery-powered portable
applications. This family ensures a very low static and dynamic power consumption across the entire V_CC range
of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see
Figure 1 and Figure 2).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2010, Texas Instruments Incorporated