SN74AUC2G66_08 Datasheet, PDF (1/18 Pages) Texas Instruments – DUAL BILATERAL ANALOG SWITCH

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FEATURES
• Available in the Texas Instruments
NanoFree™ Package
• Operates at 0.8 V to 2.7 V
• Sub-1-V Operable
• Max t_pd of 0.5 ns at 1.8 V
• Low Power Consumption, 10 µA at 2.7 V
• High On-Off Output Voltage Ratio
• High Degree of Linearity
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
SN74AUC2G66
DUAL BILATERAL ANALOG SWITCH
SCES507A – NOVEMBER 2003 – REVISED JANUARY 2007
DCT OR DCU PACKAGE
(TOP VIEW)
1A 1
1B 2
2C 3
GND 4
8 V_CC
7 1C
6 2B
5 2A
YZP PACKAGE
(BOTTOM VIEW)
GND 4 5 2A
2C 3 6 2B
1B 2 7 1C
1A 1 8 V_CC
DESCRIPTION/ORDERING INFORMATION
This dual analog switch is operational at 0.8-V to 2.7-V V_CC, but is designed specifically for 1.1-V to 2.7-V V_CC
operation.
The SN74AUC2G66 can handle both analog and digital signals. It permits signals with amplitudes of up to 2.7-V
(peak) to be transmitted in either direction.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for
analog-to-digital and digital-to-analog conversion systems.
ORDERING INFORMATION
T_A
–40°C to 85°C
PACKAGE ⁽¹⁾
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SSOP – DCT
Reel of 3000
Reel of 3000
ORDERABLE PART NUMBER TOP-SIDE MARKING⁽²⁾
SN74AUC2G66YZPR
_ _ _U6_
SN74AUC2G66DCTR
U66_ _ _
VSSOP – DCU
Reel of 3000
SN74AUC2G66DCUR
U66_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
FUNCTION TABLE
CONTROL
INPUT
(C)
L
H
SWITCH
OFF
ON
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2007, Texas Instruments Incorporated