SN74AUC2G53_07 Datasheet, PDF (1/20 Pages) Texas Instruments – SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH OR 2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER

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SN74AUC2G53
SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH OR
2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER
SCES484B – AUGUST 2003 – REVISED JANUARY 2007
FEATURES
• Available in the Texas Instruments
NanoFree™ Package
• Operates at 0.8 V to 2.7 V
• Sub-1-V Operable
• Low Power Consumption, 10 µA at 2.7 V
• High On-Off Output Voltage Ratio
• High Degree of Linearity
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DCT OR DCU PACKAGE
(TOP VIEW)
COM 1
INH 2
GND 3
GND 4
8 V_CC
7 Y1
6 Y2
5A
YZP PACKAGE
(BOTTOM VIEW)
GND 4 5 A
GND 3 6 Y2
INH 2 7 Y1
COM 1 8 V_CC
DESCRIPTION/ORDERING INFORMATION
This analog switch is operational at 0.8-V to 2.7-V V_CC, but is designed specifically for 1.1-V to 2.7-V V_CC
operation.
The SN74AUC2G53 can handle both analog and digital signals. The device permits signals with amplitudes of
up to V_CC (peak) to be transmitted in either direction.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for
analog-to-digital and digital-to-analog conversion systems.
T_A
–40°C to
85°C
ORDERING INFORMATION
PACKAGE ⁽¹⁾
ORDERABLE PART NUMBER TOP-SIDE MARKING⁽²⁾
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
Reel of 3000
SN74AUC2G53YZPR
_ _ _U4_
SSOP – DCT
Reel of 3000 SN74AUC2G53DCTR
U53_ _ _
VSSOP – DCU
Reel of 3000 SN74AUC2G53DCUR
U53_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
FUNCTION TABLE
CONTROL
INPUTS
INH
A
L
L
L
H
H
X
ON
CHANNEL
Y1
Y2
None
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2007, Texas Instruments Incorporated