SN74AUC2G07_09 Datasheet, PDF (1/13 Pages) Texas Instruments – DUAL BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS

SN74AUC2G07
www.ti.com............................................................................................................................................................... SCES443D – MAY 2003 – REVISED JUNE 2008
DUAL BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS
FEATURES
1
•2 Available in the Texas Instruments NanoFree™
Package
• Optimized for 1.8-V Operation and Is 3.6-V I/O
Tolerant to Support Mixed-Mode Signal
Operation
• I_off Supports Partial-Power-Down Mode
Operation
• Sub-1-V Operable
• Max t_pd of 2.5 ns at 1.8 V
• Low Power Consumption, 10 µA at 1.8 V
• ±8-mA Output Drive at 1.8 V
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DBV PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOM VIEW)
1A
1
GND
2
1A
1
6 1Y
2A ^{3 4 2Y}
6
1Y
GND ^{2 5 V}CC
GND
2
5
V_CC
1A ^{1 6} 1Y
5
V_CC
2A
3
4 2Y
2A
3
4
2Y
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This dual buffer/driver is operational at 0.8-V to 2.7-V V_CC, but is designed specifically for 1.65-V to 1.95-V V_CC
operation.
The output of the SN74AUC2G07 is open drain and can be connected to other open-drain outputs to implement
active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
T_A
–40C to 85C
ORDERING INFORMATION
PACKAGE ⁽¹⁾
ORDERABLE PART NUMBER
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
Reel of 3000
SN74AUC2G07YZPR
SOT (SOT-23) – DBV
Reel of 3000
Reel of 250
SN74AUC2G07DBVR
SN74AUC2G07DBVT
SOT (SC-70) – DCK
Reel of 3000
SN74AUC2G07DCKR
TOP-SIDE MARKING⁽²⁾
_ _ _UV_
U07_
UV_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2008, Texas Instruments Incorporated