SN74AUC2G06_09 Datasheet, PDF (1/13 Pages) Texas Instruments – DUAL INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS

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FEATURES
• Available in the Texas Instruments
NanoFree™ Package
• Optimized for 1.8-V Operation and Is 3.6-V I/O
Tolerant to Support Mixed-Mode Signal
Operation
• I_off Supports Partial-Power-Down Mode
Operation
• Sub-1-V Operable
• Max t_pd of 2.5 ns at 1.8 V
DBV PACKAGE
(TOP VIEW)
SN74AUC2G06
DUAL INVERTER BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
SCES442C – MAY 2003 – REVISED JANUARY 2007
• Low Power Consumption, 10 µA at 1.8 V
• ±8-mA Output Drive at 1.8 V
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DCK PACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOM VIEW)
1A
1
GND
2
6
1Y
1A
1
6 1Y
GND
2
5
V_CC
5
V_CC
2A
3
4 2Y
2A ^{3 4} 2Y
GND ^{2 5 V}_CC
1A ^{1 6} 1Y
2A
3
4
2Y
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This dual inverter buffer/driver is operational at 0.8-V to 2.7-V V_CC, but is designed specifically for 1.65-V to
1.95-V V_CC operation.
The output of the SN74AUC2G06 device is open drain and can be connected to other open-drain outputs to
implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
T_A
–40°C to 85°C
PACKAGE ⁽¹⁾
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SOT (SOT-23) – DBV
Reel of 3000
Reel of 3000
ORDERABLE PART NUMBER
SN74AUC2G06YZPR
SN74AUC2G06DBVR
SOT (SC-70) – DCK
Reel of 3000 SN74AUC2G06DCKR
TOP-SIDE MARKING⁽²⁾
_ _ _UT_
U06_
UT_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2007, Texas Instruments Incorporated