SN74AUC1G80_08 Datasheet, PDF (1/12 Pages) Texas Instruments – SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP

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SN74AUC1G80
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
SCES388K – MARCH 2002 – REVISED JANUARY 2007
FEATURES
• Available in the Texas Instruments
NanoFree™ Package
• Optimized for 1.8-V Operation and Is 3.6-V
I/O Tolerant to Support Mixed-Mode Signal
Operation
• I_off Supports Partial-Power-Down Mode
Operation
• Sub-1-V Operable
• Max t_pd of 1.9 ns at 1.8 V
DBV PACKAGE
(TOP VIEW)
• Low Power Consumption, 10-µA Max I_CC
• ±8-mA Output Drive at 1.8 V
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DCK PACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOM VIEW)
D
1
CLK
2
5
V_CC
D
1
5
V_CC
CLK
2
GND
3
4Q
GND ^{3 4} Q
CLK ²
D ^{1 5 V}_CC
GND
3
4
Q
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This single positive-edge-triggered D-type flip-flop is operational at 0.8-V to 2.7-V V_CC, but is designed
specifically for 1.65-V to 1.95-V V_CC operation.
When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the
positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the
rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without
affecting the levels at the outputs.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
T_A
–40°C to 85°C
PACKAGE ⁽¹⁾
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP
(Pb-free)
Reel of 3000
SOT (SOT-23) – DBV
Reel of 3000
ORDERABLE PART NUMBER
SN74AUC1G80YZPR
SN74AUC1G80DBVR
SOT (SC-70) – DCK
Reel of 3000
SN74AUC1G80DCKR
TOP-SIDE MARKING⁽²⁾
_ _ _UX_
U80_
UX_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2007, Texas Instruments Incorporated