SN74AUC1G19 Datasheet, PDF (1/12 Pages) Texas Instruments – 1-OF-2 DECODER/DEMULTIPLEXER

SN74AUC1G19
1ĆOFĆ2 DECODER/DEMULTIPLEXER
SCES626B – MARCH 2005 – JUNE 2005
D Available in the Texas Instruments
NanoStart and NanoFreet Package
D Optimized for 1.8-V Operation and is 3.6-V
I/O Tolerant to Support Mixed-Mode Signal
Operation
D I_off Supports Partial-Power-Down Mode
Operation
D Sub-1-V Operable
D ±8-mA Output Drive at 1.8 V V_CC
DBV PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
D Max t_pd of 3 ns at 1.8 V V_CC
D Low Power Consumption, 10-µA Max I_CC
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
DRL PACKAGE
(TOP VIEW)
YEA, YEP, YZA,
OR YZP PACKAGE
(BOTTOM VIEW)
A
1
GND
2
6
5
Y₀
V_CC
A
GND
E
1
2
3
6
Y₀
A1
6 Y₀
E ^{3 4} Y₁
5
V_CC
GND 2
E3
5 V_CC ^{GND 2 5 VCC}
4 Y₁
A ^{1 6} Y₀
4
Y₁
E
3
4
Y₁
See mechanical drawings for dimensions.
description/ordering information
This 1-of-2 decoder/demultiplexer is operational at 0.8-V to 2.7-V V_CC, but is designed specifically for 1.65-V
to 1.95-V V_CC operation.
The SN74AUC1G19 is a 1-of-2 decoder/demultiplexer. This device buffers the data on input A and passes it
to the outputs Y₀ (true) and Y₁ (complement) when the enable (E) input signal is low.
NanoStart and NanoFreet package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
NanoStar − WCSP (DSBGA)
0.23-mm Large Bump − YEP
NanoFree − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
SN74AUC1G19YEPR
Reel of 3000
U5_
SN74AUC1G19YZPR
−40°C to 85°C _{SOT (SOT-23) − DBV}
Reel of 3000
Reel of 250
SN74AUC1G19DBVR
SN74AUC1G19DBVT
U19_
U19_
SOT (SC-70) − DCK
Reel of 3000 SN74AUC1G19DCKR
U5_
Reel of 250 SN74AUC1G19DCKT
SOT (SOT-553) − DRL
Reel of 4000 SN74AUC1G19DRLR U5_
† _{Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at}
www.ti.com/sc/package.
‡ _{DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.}
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright  2005, Texas Instruments Incorporated
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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