SN74AUC1G07_07 Datasheet, PDF (1/13 Pages) Texas Instruments – SINGLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT

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SN74AUC1G07
SINGLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUT
SCES373Q – SEPTEMBER 2001 – REVISED JULY 2007
FEATURES
• Available in the Texas Instruments
NanoFree™ Package
• Optimized for 1.8-V Operation and Is 3.6-V I/O
Tolerant to Support Mixed-Mode Signal
Operation
• I_off Supports Partial-Power-Down Mode
Operation
• Sub-1-V Operable
• Max t_pd of 2.5 ns at 1.8 V
• Low Power Consumption, 10-μA Max I_CC
• ±8-mA Output Drive at 1.8 V
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DBV PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
DRY PACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOM VIEW)
NC
1
A
2
5
V_CC
NC
A
1
2
5
V_CC
GNNCAD^{PR321EVI465EWVNYCCC}
GND ^{3 4} Y
A²
DNU ^{1 5 V}_CC
GND
3
4Y
GND
3
4
Y
See mechanical drawings for dimensions.
DNU – Do not use
NC – No internal connection
DESCRIPTION/ORDERING INFORMATION
This single buffer/driver is operational at 0.8-V to 2.7-V V_CC, but is designed specifically for 1.65-V to 1.95-V V_CC
operation.
The output of the SN74AUC1G07 is open drain and can be connected to other open-drain outputs to implement
active-low wired-OR or active-high wired-AND functions.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
ORDERING INFORMATION
T_A
–40°C to 85°C
PACKAGE ^{(1) (2)}
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP
(Pb-free)
SON – DRY
Reel of 3000
Reel of 5000
ORDERABLE PART NUMBER
SN74AUC1G07YZPR
SN74AUC1G07DRYR
SOT (SOT-23) – DBV
Reel of 3000 SN74AUC1G07DBVR
SOT (SC-70) – DCK
Reel of 3000 SN74AUC1G07DCKR
TOP-SIDE MARKING⁽³⁾
_ _ _UV_
PREVIEW
U07_
UV_
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3) DBV/DCK/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2001–2007, Texas Instruments Incorporated