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SN54LV04A Datasheet, PDF (1/12 Pages) Texas Instruments – HEX INVERTERS
SN54LV04A, SN74LV04A
HEX INVERTERS
D 2-V to 5.5-V VCC Operation
D Max tpd of 6.5 ns at 5 V
D Latch-Up Performance Exceeds 250 mA Per
JESD 17
D Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
D Typical VOHV (Output VOH Undershoot)
>2.3 V at VCC = 3.3 V, TA = 25°C
SCLS388H – SEPTEMBER 1997 – REVISED JULY 2003
D Support Mixed-Mode Voltage Operation on
All Ports
D Ioff Supports Partial-Power-Down Mode
Operation
D ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
SN54LV04A . . . J OR W PACKAGE
SN74LV04A . . . D, DB, DGV, NS,
OR PW PACKAGE
(TOP VIEW)
SN74LV04A . . . RGY PACKAGE
(TOP VIEW)
SN54LV04A . . . FK PACKAGE
(TOP VIEW)
1A 1
1Y 2
2A 3
2Y 4
3A 5
3Y 6
GND 7
14 VCC
13 6A
12 6Y
11 5A
10 5Y
9 4A
8 4Y
1
1Y 2
2A 3
2Y 4
3A 5
3Y 6
7
14
13 6A
12 6Y
11 5A
10 5Y
9 4A
8
3 2 1 20 19
2A 4
18 6Y
NC 5
17 NC
2Y 6
16 5A
NC 7
15 NC
3A 8
14 5Y
9 10 11 12 13
description/ordering information
NC – No internal connection
These hex inverters are designed for 2-V to 5.5-V VCC operation. The ’LV04A devices contain six independent
inverters. These devices perform the Boolean function Y = A.
These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow through the devices when they are powered down.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
QFN – RGY
Reel of 1000 SN74LV04ARGYR LV04A
SOIC – D
Tube of 50
Reel of 2500
SN74LV04AD
SN74LV04ADR
LV04A
SOP – NS
Reel of 2000 SN74LV04ANSR
74LV04A
–40°C to 85°C SSOP – DB
Reel of 2000 SN74LV04ADBR
LV04A
Tube of 90
SN74LV04APW
TSSOP – PW Reel of 2000 SN74LV04APWR
LV04A
Reel of 250
SN74LV04APWT
TVSOP – DGV Reel of 2000 SN74LV04ADGVR LV04A
CDIP – J
Tube of 25
SNJ54LV04AJ
SNJ54LV04AJ
–55°C to 125°C CFP – W
Tube of 150
SNJ54LV04AW
SNJ54LV04AW
LCCC – FK
Tube of 55
SNJ54LV04AFK
SNJ54LV04AFK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
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Copyright  2003, Texas Instruments Incorporated
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