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SN54BCT245 Datasheet, PDF (1/7 Pages) Texas Instruments – OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS
• State-of-the-Art BiCMOS Design
Significantly Reduces ICCZ
• ESD Protection Exceeds 2000 V
Per MIL-STD-883C, Method 3015
• 3-State Outputs Drive Bus Lines or Buffer
Memory Address Registers
• Package Options Include Plastic
Small-Outline (DW) and Shrink
Small-Outline (DB) Packages, Ceramic Chip
Carriers (FK) and Flatpacks (W), and
Standard Plastic and Ceramic 300-mil DIPs
(J, N)
description
These octal bus transceivers are designed for
asynchronous communication between data
buses. The devices transmit data from the A bus
to the B bus or from the B bus to the A bus
depending upon the level at the direction-control
(DIR) input. The output-enable (OE) input can be
used to disable the device so the buses are
effectively isolated.
The SN74BCT245 is available in TI’s shrink
small-outline package (DB), which provides the
same I/O pin count and functionality of standard
small-outline packages in less than half the
printed-circuit-board area.
The SN54BCT245 is characterized for operation
over the full military temperature range of – 55°C
to 125°C. The SN74BCT245 is characterized for
operation from 0°C to 70°C.
SN54BCT245, SN74BCT245
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCBS013F – SEPTEMBER 1988 – REVISED APRIL 1994
SN54BCT245 . . . J OR W PACKAGE
SN74BCT245 . . . DB, DW, OR N PACKAGE
(TOP VIEW)
DIR 1
A1 2
A2 3
A3 4
A4 5
A5 6
A6 7
A7 8
A8 9
GND 10
20 VCC
19 OE
18 B1
17 B2
16 B3
15 B4
14 B5
13 B6
12 B7
11 B8
SN54BCT245 . . . FK PACKAGE
(TOP VIEW)
3 2 1 20 19
A3 4
18 B1
A4 5
17 B2
A5 6
16 B3
A6 7
15 B4
A7 8
14 B5
9 10 11 12 13
FUNCTION TABLE
INPUTS
OE DIR
OPERATION
L
L
B data to A bus
L
H
A data to B bus
H
X
Isolation
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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Copyright © 1994, Texas Instruments Incorporated
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