SN54AHC367 Datasheet, PDF (1/12 Pages) Texas Instruments – HEX BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS

D Operating Range 2-V to 5.5-V V_CC
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
description
The ’AHC367 devices are hex buffers and line
drivers designed for 2-V to 5.5-V V_CC operation.
These devices are designed specifically to
improve both the performance and density of
3-state memory address drivers, clock drivers,
and bus-oriented receivers and transmitters. The
’AHC367 devices are organized as dual 4-line
and 2-line buffers/drivers with active-low
output-enable (1OE and 2OE) inputs. When OE is
low, the device passes noninverted data from the
A inputs to the Y outputs. When OE is high, the
outputs are in the high-impedance state.
To ensure the high-impedance state during power
up or power down, OE should be tied to V_CC
through a pullup resistor; the minimum value of
the resistor is determined by the current-sinking
capability of the driver.
SN54AHC367, SN74AHC367
HEX BUFFERS AND LINE DRIVERS
WITH 3-STATE OUTPUTS
SCLS424E – JUNE 1998 – REVISED FEBRUARY 2002
SN54AHC367 . . . J OR W PACKAGE
SN74AHC367 . . . D, DB, DGV, N, OR PW PACKAGE
(TOP VIEW)
1OE ₁
1A1 2
1Y1 3
1A2 4
1Y2 5
1A3 6
1Y3 7
GND 8
16 ^V_CC
15 2OE
14 2A2
13 2Y2
12 2A1
11 2Y1
10 1A4
9 1Y4
SN54AHC367 . . . FK PACKAGE
(TOP VIEW)
1Y1
3 2 1 20 19
4
18
2A2
1A2 5
17 2Y2
NC 6
16 NC
1Y2 7
15 2A1
1A3 8
14 2Y1
9 10 11 12 13
NC – No internal connection
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
PDIP – N
Tube
SN74AHC367N
SN74AHC367N
–40°C to 85°C
SOIC – D
SSOP – DB
Tube
Tape and reel
Tape and reel
SN74AHC367D
SN74AHC367DR
SN74AHC367DBR
AHC367
HA367
TSSOP – PW
Tape and reel SN74AHC367PWR
HA367
TVSOP – DGV
Tape and reel SN74AHC367DGVR
HA367
–55°C to 125°C
CDIP – J
CFP – W
Tube
Tube
SNJ54AHC367J
SNJ54AHC367W
SNJ54AHC367J
SNJ54AHC367W
LCCC – FK
Tube
SNJ54AHC367FK
SNJ54AHC367FK
† _{Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines}
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
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Copyright  2002, Texas Instruments Incorporated
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