SN54ABT126 Datasheet, PDF (1/14 Pages) Texas Instruments – QUADRUPLE BUS BUFFER GATES WITH 3-STATE OUTPUTS

D Typical V_OLP (Output Ground Bounce)
<1 V at V_CC = 5 V, T_A = 25°C
D High-Impedance State During Power Up
and Power Down
D High-Drive Outputs (–32-mA I_OH, 64-mA I_OL)
SN54ABT126, SN74ABT126
QUADRUPLE BUS BUFFER GATES
WITH 3-STATE OUTPUTS
SCBS183H – FEBRUARY 1991 – REVISED MAY 2003
D I_off and Power-Up 3-State Support Hot
Insertion
D Latch-Up Performance Exceeds 500 mA Per
JESD 17
D ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
SN54ABT126 . . . J PACKAGE
SN74ABT126 . . . D, DB, N, NS,
OR PW PACKAGE
(TOP VIEW)
1OE 1
1A 2
1Y 3
2OE 4
2A 5
2Y 6
GND 7
14 V_CC
13 4OE
12 4A
11 4Y
10 3OE
9 3A
8 3Y
SN74ABT126 . . . RGY PACKAGE
(TOP VIEW)
1
1A 2
1Y 3
2OE 4
2A 5
2Y 6
7
14
13 4OE
12 4A
11 4Y
10 3OE
9 3A
8
SN54ABT126 . . . FK PACKAGE
(TOP VIEW)
1Y
NC
2OE
NC
2A
3 2 1 20 19
4
18
5
17
6
16
7
15
8
14
9 10 11 12 13
4A
NC
4Y
NC
3OE
description/ordering information
NC – No internal connection
The ’ABT126 bus buffer gates feature independent line drivers with 3-state outputs. Each output is disabled
when the associated output-enable (OE) input is low.
When V_CC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 2.1 V, OE should be tied to GND through a pulldown
resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
QFN – RGY
Tape and reel SN74ABT126RGYR
AB126
PDIP – N
Tube
SN74ABT126N
SN74ABT126N
–40°C to 85°C
SOIC – D
SOP – NS
Tube
Tape and reel
Tape and reel
SN74ABT126D
SN74ABT126DR
SN74ABT126NSR
ABT126
ABT126
SSOP – DB
Tape and reel SN74ABT126DBR
AB126
TSSOP – PW
Tube
Tape and reel
SN74ABT126PW
SN74ABT126PWR
AB126
CDIP – J
–55°C to 125°C
LCCC – FK
Tube
Tube
SNJ54ABT126J
SNJ54ABT126FK
SNJ54ABT126J
SNJ54ABT126FK
† _{Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are}
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
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