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LMZ10503 Datasheet, PDF (1/28 Pages) National Semiconductor (TI) – 3A SIMPLE SWITCHER® Power Module with 5.5V Maximum Input Voltage
LMZ10503
www.ti.com
SNVS641H – JANUARY 2010 – REVISED APRIL 2013
LMZ10503 3A SIMPLE SWITCHER® Power Module with 5.5V Maximum Input Voltage
Check for Samples: LMZ10503
FEATURES
1
•2 Integrated Shielded Inductor
• Flexible Startup Sequencing using External
Soft-Start, Tracking, and Precision Enable
• Protection Against In-Rush Currents and
Faults Such as Input UVLO and Output Short-
Circuit
• -40°C to +125°C Junction Temperature
Operating Range
• Single Exposed pad and Standard Pinout for
Easy Mounting and Manufacturing
• Pin-to-Pin Compatible with
– LMZ10504 (4A/20W max)
– LMZ10505 (5A/25W max)
• Fully Enabled for WEBENCH® and Power
Designer
APPLICATIONS
• Point-of-Load Conversions from 3.3V and 5V
Rails
• Space Constrained Applications
• Extreme Temperatures/no Air Flow
Environments
• Noise Sensitive Applications (i.e. Transceiver,
Medical)
PERFORMANCE BENEFITS
• Operates at High Ambient Temperatures
• High Efficiency up to 96% Reduces System
Heat Generation
• Low Radiated Emissions (EMI) Complies with
EN55022 Class B Standard (2)
• Low Output Voltage Ripple of 10 mV Allows
for Powering Noise-Sensitive Transceiver and
Signaling ICs
• Fast Transient Response for Powering FPGAs
and ASICs
ELECTRICAL SPECIFICATIONS
• 15W Maximum Total Output Power
• Up to 3A Output Current
• Input Voltage Range 2.95V to 5.5V
• Output Voltage Range 0.8V to 5V
• ±1.63% Feedback Voltage Accuracy Over
Temperature
• Efficiency up to 96%
DESCRIPTION
The LMZ10503 SIMPLE SWITCHER® power module
is a complete, easy-to-use DC-DC solution capable of
driving up to a 3A load with exceptional power
conversion efficiency, output voltage accuracy, line
and load regulation. The LMZ10503 is available in an
innovative package that enhances thermal
performance and allows for hand or machine
soldering.
Figure 1. PFM 7 Pin Package
10.16 x 13.77 x 4.57 mm (0.4 x 0.39 x 0.18 in)
θJA = 20°C/W, θJC = 1.9°C/W (1)
RoHS Compliant
(1) θ JA measured on a 2.25” x 2.25” (5.8 cm x 5.8 cm) four layer
board, with one ounce copper, thirty six 10mil thermal vias, no
air flow, and 1W power dissipation. Refer to PCB Layout
Diagrams or Evaluation Board Application Note: AN-2022
(SNVA421).
(2) EN 55022:2006, +A1:2007, FCC Part 15 Subpart B: 2007.
See Table 9 and layout for information on device under test.
1
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Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010–2013, Texas Instruments Incorporated