LMV341-Q1_15 Datasheet, PDF (1/27 Pages) Texas Instruments – RAIL-TO-RAIL OUTPUT CMOS OPERATIONAL AMPLIFIERS

LMV341-Q1
LMV344-Q1
www.ti.com.............................................................................................................................................................. SGLS342C – JULY 2006 – REVISED JUNE 2009
RAIL-TO-RAIL OUTPUT CMOS OPERATIONAL AMPLIFIERS
FEATURES
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• Qualified for Automotive Applications
• 2.7-V and 5-V Performance
• Rail-to-Rail Output Swing
• Input Bias Current: 1 pA Typ
• Input Offset Voltage: 0.25 mV Typ
LMV341
DBV OR DCK PACKAGE
(TOP VIEW)
IN+
GND
16
25
V
+
SHDN
IN– 3 4 OUT
• Low Supply Current: 100 µA Typ
• Gain Bandwidth: 1 MHz Typ
• Slew Rate: 1 V/µs Typ
• Turn-On Time From Shutdown: 5 µs Typ
• Input Referred Voltage Noise (at 10 kHz):
20 nV/√Hz
LMV344
PW PACKAGE
(TOP VIEW)
1OUT 1
1IN- 2
1IN+ 3
V₊ 4
2IN+ 5
2IN- ⁶
2OUT ⁷
14 4OUT
13 4IN-
12 4IN+
11 GND
10 3IN+
9 3IN-
8 _3OUT
DESCRIPTION/ORDERING INFORMATION
The LMV341 and LMV344 devices are single and quad CMOS operational amplifiers, respectively, with low
voltage, low power, and rail-to-rail output swing capabilities. The PMOS input stage offers an ultra-low input bias
current of 1 pA (typ) and an offset voltage of 0.25 mV (typ). The single supply amplifier is designed specifically
for low-voltage (2.7 V to 5 V) operation, with a wide common-mode input voltage range that typically extends
from –0.2 V to 0.8 V from the positive supply rail. Additional features are a 20-nV/√Hz voltage noise at 10 kHz,
1-MHz unity-gain bandwidth, 1-V/µs slew rate, and 100-µA current consumption per channel.
An extended industrial temperature range from –40°C to 125°C makes this device suitable for automotive
applications.
T_A
–40°C to 125°C
ORDERING INFORMATION⁽¹⁾
PACKAGE ⁽²⁾
ORDERABLE PART NUMBER
SC-70 – DCK
Reel of 3000
LMV341QDCKRQ1
SOT-23 – DBV
Reel of 3000
LMV341QDBVRQ1
TSSOP – PW
Reel of 2000
LMV344IPWRQ1
TOP-SIDE MARKING⁽³⁾
RR_
RCH_
LMV344Q
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) DBV/DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2009, Texas Instruments Incorporated