LMV321 Datasheet, PDF (1/31 Pages) Texas Instruments – LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS

LMV321 SINGLE, LMV358 DUAL, LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOWĆVOLTAGE RAILĆTOĆRAIL OUTPUT OPERATIONAL AMPLIFIERS
D 2.7-V and 5-V Performance
D −405C to 1255C Operation
D Low-Power Shutdown Mode (LMV324S)
D No Crossover Distortion
D Low Supply Current
− LMV321 . . . 130 µA Typ
− LMV358 . . . 210 µA Typ
− LMV324 . . . 410 µA Typ
− LMV324S . . . 410 µA Typ
D Rail-to-Rail Output Swing
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 1000-V Charged-Device Model (C101)
description/ordering information
The LMV321, LMV358, and LMV324/LMV324S
are single, dual, and quad low-voltage (2.7 V to
5.5 V), operational amplifiers with rail-to-rail
output swing. The LMV324S, which is a variation
of the standard LMV324, includes a power-saving
shutdown feature that reduces supply current to a
maximum of 5 µA per channel when the amplifiers
are not needed. Channels 1 and 2 together are put
in shutdown, as are channels 3 and 4. While in
shutdown, the outputs actively are pulled low.
The LMV321, LMV358, LMV324, and LMV324S
are the most cost-effective solutions for
applications where low-voltage operation, space
saving, and low cost are needed. These amplifiers
were designed specifically for low-voltage (2.7 V
to 5 V) operation, with performance specifications
meeting or exceeding the LM358 and LM324
devices that operate from 5 V to 30 V. Additional
features of the LMV3xx devices are a
common-mode input voltage range that includes
ground, 1-MHz unity-gain bandwidth, and 1-V/µs
slew rate.
The LMV321 is available in the ultra-small DCK
(SC-70) package, which is approximately
one-half the size of the DBV (SOT-23) package.
This package saves space on printed circuit
boards and enables the design of small portable
electronic devices. It also allows the designer to
place the device closer to the signal source to
reduce noise pickup and increase signal integrity.
SLOS263Q − AUGUST 1999 − REVISED OCTOBER 2004
LMV324 . . . D (SOIC) OR PW (TSSOP) PACKAGE
(TOP VIEW)
1OUT 1
1IN− 2
1IN+ 3
V_CC+ 4
2IN+ ⁵
2IN− ⁶
2OUT ⁷
14 4OUT
13 4IN−
12 4IN+
11 GND
10 3IN+
9 3IN−
8 3OUT
LMV324S . . . D (SOIC) OR PW (TSSOP) PACKAGE
(TOP VIEW)
1OUT 1
1IN− 2
1IN+ 3
V_CC 4
2IN+ 5
2IN− 6
2OUT 7
1/2 SHDN 8
16 4OUT
15 4IN−
14 4IN+
13 GND
12 3IN+
11 3IN−
10 3OUT
9 3/4 SHDN
LMV358 . . . D (SOIC), DDU (VSSOP),
DGK (MSOP), OR PW (TSSOP PACKAGE
(TOP VIEW)
1OUT 1
1IN− 2
1IN+ 3
GND 4
8 V_CC+
7 2OUT
6 2IN−
5 2IN+
LMV321 . . . DBV (SOT-23) OR DCK (SC-70) PACKAGE
(TOP VIEW)
1IN+ 1
GND ²
IN− ³
5 V_CC+
4 _OUT
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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Copyright  2004, Texas Instruments Incorporated
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