English
Language : 

LM385BXM-1.2 Datasheet, PDF (1/23 Pages) Texas Instruments – LM185-1.2-N/LM285-1.2-N/LM385-1.2-N Micropower Voltage Reference Diode
LM185-1.2-N, LM285-1.2-N, LM385-1.2-N
www.ti.com
SNVS742E – JANUARY 2000 – REVISED APRIL 2013
LM185-1.2-N/LM285-1.2-N/LM385-1.2-N Micropower Voltage Reference Diode
Check for Samples: LM185-1.2-N, LM285-1.2-N, LM385-1.2-N
FEATURES
1
•2 ±1% and 2% Initial Tolerance
• Operating Current of 10μA to 20mA
• 1Ω Dynamic Impedance
• Low Temperature Coefficient
• Low Voltage Reference—1.235V
• 2.5V Device and Adjustable Device Also
Available
• LM185-2.5 Series and LM185 Series,
respectively
DESCRIPTION
The LM185-1.2-N/LM285-1.2-N/LM385-1.2-N are
micropower 2-terminal band-gap voltage regulator
diodes. Operating over a 10μA to 20mA current
range, they feature exceptionally low dynamic
impedance and good temperature stability. On-chip
trimming is used to provide tight voltage tolerance.
Since the LM185-1.2-N band-gap reference uses only
transistors and resistors, low noise and good long
term stability result.
Careful design of the LM185-1.2-N has made the
device exceptionally tolerant of capacitive loading,
making it easy to use in almost any reference
application. The wide dynamic operating range allows
its use with widely varying supplies with excellent
regulation.
The extremely low power drain of the LM185-1.2-N
makes it useful for micropower circuitry. This voltage
reference can be used to make portable meters,
regulators or general purpose analog circuitry with
battery life approaching shelf life.
Further, the wide operating current allows it to
replace older references with a tighter tolerance part.
The LM185-1.2-N is rated for operation over a −55°C
to 125°C temperature range while the LM285-1.2-N is
rated −40°C to 85°C and the LM385-1.2-N 0°C to
70°C. The LM185-1.2-N/LM285-1.2-N are available in
a hermetic TO package and the LM285-1.2-N/LM385-
1.2-N are also available in a low-cost TO-92 molded
package, as well as SOIC and SOT-23.
CONNECTION DIAGRAM
Figure 1. T0-92 Package (LP)
(Bottom View)
Figure 3. SOIC Package
* Pin 3 is attached to the Die Attach Pad
(DAP) and should be connected to Pin 2 or
left floating.
Figure 2. SOT-23
Figure 4. TO Package (NDV)
(Bottom View)
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2013, Texas Instruments Incorporated