DAC5681 Datasheet, PDF (1/47 Pages) Texas Instruments – 16-BIT, 1.0 GSPS DIGITAL-TO-ANALOG CONVERTER (DAC)

DAC5681
www.ti.com ................................................................................................................................................. SLLS864A – AUGUST 2007 – REVISED JANUARY 2009
16-BIT, 1.0 GSPS
DIGITAL-TO-ANALOG CONVERTER (DAC)
FEATURES
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• 16-Bit Digital-to-Analog Converter (DAC)
• 1.0 GSPS Update Rate
• 16-Bit Wideband Input LVDS Data Bus
– 8 Sample Input FIFO
– On-Chip Delay Lock Loop
• High Performance
– 73 dBc ACLR WCDMA TM1 at 180 MHz
• On Chip 1.2 V Reference
• Differential Scalable Output: 2 to 20 mA
• Package: 64-Pin 9 × 9 mm QFN
APPLICATIONS
• Cellular Base Stations
• Broadband Wireless Access (BWA)
• WiMAX 802.16
• Fixed Wireless Backhaul
• Cable Modem Termination System (CMTS)
• Medical / Test Instrumentation
• Radar Systems
DESCRIPTION
The DAC5681 is a 16-bit 1.0 GSPS digital-to-analog
converter (DAC) with wideband LVDS data input and
internal voltage reference. The DAC5681 offers
superior linearity and noise performance.
The DAC5681 integrates a wideband LVDS port with
on-chip termination, providing full 1.0 GSPS data
transfer into the DAC and lower EMI than traditional
CMOS data interfaces. An on-chip delay lock loop
(DLL) simplifies LVDS interfacing by providing skew
control for the LVDS input data clock.
The current-steering architecture of the DAC5681
consists of a segmented array of current sinking
switches directing up to 20mA of full-scale current to
complementary output nodes. An accurate on-chip
voltage reference is temperature-compensated and
delivers a stable 1.2-V reference voltage. Optionally,
an external reference may be used.
The DAC5681 is characterized for operation over the
industrial temperature range of –40°C to 85°C and is
available in a 64-pin QFN package. The device is pin
upgradeable to the other members of the family: the
DAC5681Z and DAC5682Z. The single-channel
DAC5681Z and dual-channel DAC5682Z both
provide optional 2x/4x interpolation and a clock
multiplying PLL.
T_A
–40°C to 85°C
ORDER CODE
DAC5681IRGCT
DAC5681IRGCR
ORDERING INFORMATION
PACKAGE DRAWING/TYPE^(1)(2)(3)
TRANSPORT MEDIA
RGC / 64QFN Quad Flatpack
No-Lead
Tape and Reel
Tape and Reel
QUANTITY
250
2000
(1) Thermal Pad Size: 7,4 mm × 7,4 mm
(2) MSL Peak Temperature: Level-3-260C-168 HR
(3) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2009, Texas Instruments Incorporated