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DAC3152_15 Datasheet, PDF (1/31 Pages) Texas Instruments – Dual-Channel, 10-/12-Bit, 500-MSPS Digital-to-Analog Converters (DACs)
DAC3152
DAC3162
www.ti.com
SLAS736D – NOVEMBER 2010 – REVISED AUGUST 2012
Dual-Channel, 10-/12-Bit, 500-MSPS Digital-to-Analog Converters (DACs)
Check for Samples: DAC3152, DAC3162
FEATURES
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• Low Power: 270 mW at 500 MSPS
• LVDS Input Data Bus
– Interleaved DDR Data Load
• High DC Accuracy: ±0.25 LSB DNL (10-bit),
± 0.5 LSB INL (12-bit)
• Low Latency: 1.5 Clock Cycles
• Simple Control: No Software Required
• Differential Scalable Output: 2 mA to 20 mA
• On-Chip 1.2-V Reference
• 1.8-V and 3.3-V DC Supplies
• Space Saving Package: 48-pin 7-mm × 7-mm
QFN
APPLICATIONS
• Cellular Base Stations
• Wideband Communications
• Medical Instrumentation
• Test and Measurement
DESCRIPTION
The DAC3152/DAC3162 is a low-power, low-latency,
high-dynamic-range, dual-channel, 10-/12-bit, pin-
compatible family of digital-to-analog converters
(DACs) with a sample rate as high as 500 MSPS.
The device simplicity (no software required), low
latency, and low power simplify the design of complex
systems. The DACs interface seamlessly with the
high-performance TRF370333 analog quadrature
modulator for direct upconversion architectures.
Digital data for both DAC channels is interleaved
through a single LVDS data bus with on-chip
termination. The high input rate of the devices allows
the processing of wide-bandwidth signals.
The devices are characterized for operation over the
entire industrial temperature range of –40°C to 85°C
and are available in a small 48-pin 7-mm × 7-mm
QFN package.
The low power, small size, speed, superior crosstalk,
simplicity, and low latency of the DAC3152/DAC3162
make them an attractive fit for a variety of
applications.
FUNCTIONAL BLOCK DIAGRAM
DACCLKP
LVPECL
DACCLKN
D11P LVDS
D11N
D0P LVDS
D0N
VREF
Clock Distribution
1.2-V
Reference
BIASJ
12/10
12/10
DACA
IOUTAP
IOUTAN
DACB
IOUTBP
IOUTBN
AVDD33
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010–2012, Texas Instruments Incorporated