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CSD96370Q5M_1110 Datasheet, PDF (1/19 Pages) Texas Instruments – Synchronous Buck NexFET™ Power Stage
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CSD96370Q5M
SLPS265C – NOVEMBER 2010 – REVISED OCTOBER 2011
Synchronous Buck NexFET™ Power Stage
FEATURES
1
• 90% System Efficiency at 25A
• High Frequency Operation (Up To 2MHz)
• Incorporates Power Block Technology
• High Density – SON 5-mm × 6-mm Footprint
• Low Power Loss 2.6W at 25A
• Ultra Low Inductance Package
• System Optimized PCB Footprint
• 3.3V and 5V PWM Signal Compatible
• 3-State PWM Input
• Integrated Bootstrap Diode
• Pre-Bias Start-Up Protection
• Shoot Through Protection
• RoHS Compliant – Lead Free Terminal Plating
Halogen Free
APPLICATIONS
• Synchronous Buck Converters
• Multiphase Synchronous Buck Converters
• POL DC-DC Converters
• Memory and Graphic Cards
• Desktop and Server VR11.x and VR12 V-Core
Synchronous Buck Converters
ORDERING INFORMATION
Device
Package
Media Qty
CSD96370Q5M
SON 5-mm × 6-mm
Plastic Package
13-Inch
Reel
2500
Ship
Tape and
Reel
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DESCRIPTION
The CSD96370Q5M NexFET Power Stage is an optimized design for use in a high power, high density
Synchronous Buck converter. This product integrates an enhanced gate driver IC and Power Block Technology
to complete the power stage switching function. This combination produces a high current, high efficiency, high
speed switching device and delivers an excellent thermal solution in a small 5-mm × 6-mm outline package due
to its large ground based thermal pad. In addition, the PCB footprint has been optimized to help reduce design
time and simplify the completion of the overall system design.
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VIN
100
5
VDD
CSD96370Q5M
LO
VOUT
VCC
VOUT PWM1
SS
PWM2
RT
PGND
LO
Multi Phase
Control IC
CSD96370Q5M
Figure 1. Application Diagram
CIN
VOUT
COUT
S0488-01
90
4
VDD = 5V
VIN = 12V
80
VOUT = 1.2V
3
LOUT = 0.3µH
fSW = 500kHz
70
TA = 25°C
2
60
1
Efficiency
Power Loss
50
0
0
5
10
15
20
25
Output Current (A)
G029
Figure 2. Efficiency and Power Loss
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010–2011, Texas Instruments Incorporated