English
Language : 

CSD17303Q5 Datasheet, PDF (1/9 Pages) Texas Instruments – 30V N-Channel NexFET™ Power MOSFET
CSD17303Q5
www.ti.com
SLPS246A – JANUARY 2010 – REVISED FEBRUARY 2010
30V N-Channel NexFET™ Power MOSFET
Check for Samples: CSD17303Q5
FEATURES
1
•2 Optimized for 5V Gate Drive
• Ultralow Qg and Qgd
• Low Thermal Resistance
• Avalanche Rated
• Pb Free Terminal Plating
• RoHS Compliant
• Halogen Free
• SON 5-mm × 6-mm Plastic Package
APPLICATIONS
• Notebook Point-of-Load
• Point-of-Load Synchronous Buck in
Networking, Telecom and Computing Systems
• Optimized for Synchronous FET Applications
DESCRIPTION
The NexFET™ power MOSFET has been designed
to minimize losses in power conversion applications,
and optimized for 5V gate drive applications.
Top View
S1
8D
S2
7D
S3
D
G4
6D
5D
P0094-01
VDS
Qg
Qgd
RDS(on)
VGS(th)
PRODUCT SUMMARY
Drain to Source Voltage
30
Gate Charge Total (4.5V)
18
Gate Charge Gate to Drain
4
Drain to Source On Resistance
Threshold Voltage
VGS = 3V
VGS = 4.5V
VGS = 8V
1.1
V
nC
nC
2.7 mΩ
2 mΩ
1.7 mΩ
V
text
text
ORDERING INFORMATION
Device
Package
Media Qty
CSD17303Q5
SON 5-mm × 6-mm
Plastic Package
13-Inch
Reel
2500
Ship
Tape and
Reel
text
text
ABSOLUTE MAXIMUM RATINGS
TA = 25°C unless otherwise stated
VDS Drain to Source Voltage
VGS Gate to Source Voltage
ID
Continuous Drain Current, TC = 25°C
Continuous Drain Current(1)
IDM Pulsed Drain Current, TA = 25°C(2)
PD
Power Dissipation(1)
TJ, Operating Junction and Storage
TSTG Temperature Range
EAS
Avalanche Energy, single pulse
ID = 103A, L = 0.1mH, RG = 25Ω
VALUE
30
+10 / –8
100
32
200
3.2
UNIT
V
V
A
A
A
W
–55 to 150 °C
530
mJ
(1) RqJA = 39°C/W on 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick)
Cu pad on a 0.06-inch (1.52-mm) thick FR4 PCB.
(2) Pulse duration ≤300ms, duty cycle ≤2%"
RDS(on) vs VGS
6
ID = 25A
5
4
TC = 125°C
3
2
TC = 25°C
1
0
0 1 2 3 4 5 6 7 8 9 10
VGS - Gate-to-Source Voltage - V
G006
GATE CHARGE
8
7
ID = 25A
VDS = 15V
6
5
4
3
2
1
0
0
5
10
15
20
25
30
35
Qg - Gate Charge - nC
G003
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NexFET is a trademark of Texas Instruments.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010, Texas Instruments Incorporated