SISA12ADN Datasheet, PDF (1/13 Pages) Vishay Telefunken – N-Channel 30 V (D-S) MOSFET

New Product
N-Channel 30 V (D-S) MOSFET
SiSA12ADN
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) () (Max.)
0.0043 at V_GS = 10 V
30
0.0060 at V_GS = 4.5 V
I_D (A)^{a, g}
25
25
Q_g (Typ.)
13.6 nC
PowerPAK^® 1212-8
3.3 mm
D
8
D
7
D
6
D
5
S
1
S
3.3 mm
2
S
3
G
4
Bottom View
Ordering Information:
SiSA12ADN-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• TrenchFET^® Gen IV Power MOSFET
• 100 % R_g and UIS Tested
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
• Switch Mode Power Supplies
D
• Personal Computers and Servers
• Telecom Bricks
• VRM’s and POL
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
30
V
V_GS
+ 20, - 16
T_C = 25 °C
25^g
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
25^g
22^{b, c}
Pulsed Drain Current (t = 300 µs)
T_A = 70 °C
18^{b, c}
A
I_DM
80
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
23^g
2.9^{b, c}
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L =0.1 mH
I_AS
15
E_AS
11
mJ
T_C = 25 °C
28
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
18
3.5^{b, c}
W
T_A = 70 °C
2.2^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t  10 s
R_thJA
29
Steady State
R_thJC
3.6
36
°C/W
4.5
Notes:
a. Based on T_C = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 81 °C/W.
g. Package limited.
Document Number: 63234
For technical questions, contact: [e-mail]
www.vishay.com
S13-0113-Rev. A, 21-Jan-13
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000