SIS822DNT Datasheet, PDF (1/8 Pages) Vishay Telefunken – N-Channel 30 V (D-S) MOSFET

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SiS822DNT
Vishay Siliconix
N-Channel 30 V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
30
R_DS(on) (Ω) MAX.
0.024 at V_GS = 10 V
0.030 at V_GS = 4.5 V
I_D (A) ^a
12
12
0.8 mm
Thin PowerPAK^® 1212-8 Single
D
D
D
6
D
7
8
5
Q_g (TYP.)
3.8 nC
3.3 _mm
1
Top View
3.3 ^mm
1
3
2
S
S
4_S
G
Bottom View
Ordering Information:
SiS822DNT-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• TrenchFET^® power MOSFET
• 100 % R_g and UIS tested
• Thin 0.8 mm profile
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
D
• Notebook PC
- System power
- Load switch
• Synchronous buck high-side
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
V_DS
Gate-Source Voltage
V_GS
T_C = 25 °C
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
T_A = 70 °C
Pulsed Drain Current (t = 100 μs)
I_DM
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L = 0.1 mH
I_AS
E_AS
T_C = 25 °C
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
T_A = 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) ^{e, f}
T_J, T_stg
LIMIT
30
± 20
12 ^a
12 ^a
8.7 ^{b, c}
7 ^{b, c}
30
12 ^a
2.7 ^{b, c}
5
1.25
15.6
10
3.2 ^{b, c}
2 ^{b, c}
-55 to 150
260
UNIT
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYPICAL
MAXIMUM
UNIT
Maximum Junction-to-Ambient ^{b, d}
t ≤ 10 s
R_thJA
32
Maximum Junction-to-Case (Drain)
Steady State
R_thJC
6.5
39
°C/W
8
Notes
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. Maximum under steady state conditions is 81 °C/W.
e. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
f. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
S14-1340-Rev. A, 30-Jun-14
1
Document Number: 62965
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000