SIS782DN Datasheet, PDF (1/14 Pages) Vishay Siliconix – N-Channel 30 V (D-S) MOSFET with Schottky Diode

SiS782DN
Vishay Siliconix
N-Channel 30 V (D-S) MOSFET with Schottky Diode
PRODUCT SUMMARY
V_DS (V)
R_DS(on) ()
0.0095 at V_GS = 10 V
30
0.0120 at V_GS = 4.5 V
I_D (A)^e
16
16
Q_g (Typ.)
9.5 nC
PowerPAK 1212-8
3.30 mm
S
1
S
3.30 mm
2
S
3
G
4
D
8
D
7
D
6
D
5
Bottom View
Ordering Information:
SiS782DN-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• SkyFET^® Monolithic TrenchFET^® Power MOSFET
and Schottky Diode
• Low Thermal Resistance PowerPAK^® Package
with Small Size and Low 1.07 mm Profile
• 100 % R_g and UIS Tested
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
• Notebook PC
- System Power, Memory
• Buck Converter
• Synchronous Rectifier Switch
D
G
N-Channel MOSFET
Schottky Diode
S
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
30
V
V_GS
± 20
T_C = 25 °C
16^e
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
16^e
14.5^{a, b}
Pulsed Drain Current (t = 300 µs)
T_A = 70 °C
11.5^{a, b}
A
I_DM
50
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
16^e
4^{a, b}
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L = 0.1 mH
I_AS
15
E_AS
11.25
mJ
T_C = 25 °C
41
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
26
3.6^{a, b}
W
T_A = 70 °C
2.3^{a, b}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{c, d}
T_J, T_stg
- 50 to 150
°C
260
Notes:
a. Surface mounted on 1" x 1" FR4 board.
b. t = 10 s.
c. See solder profile (www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
e. Package limited.
Document Number: 67954
www.vishay.com
S11-1177-Rev. A, 13-Jun-11
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000