SIS612EDNT Datasheet, PDF (1/8 Pages) Vishay Telefunken – N-Channel 20 V (D-S) MOSFET

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SiS612EDNT
Vishay Siliconix
N-Channel 20 V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
20
R_DS(on) () Max.
0.0039 at V_GS = 4.5 V
0.0042 at V_GS = 3.7 V
0.0058 at V_GS = 2.5 V
I_D (A)^{f, g}
50
50
50
Q_g (Typ.)
22.5 nC
Thin PowerPAK^® 1212-8
3.30 mm
S
1
S
3.30 mm
2
S
3
G
4
0.75 mm
D
8
D
7
D
6
D
5
Bottom View
Ordering Information:
SiS612EDNT-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• TrenchFET^® Power MOSFET
• 100 % R_g and UIS Tested
• Low Thermal Resistance PowerPAK Package
with Small Size and 0.75 mm Profile
• Typical ESD performance 3400 V
• Material categorization: 
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
D
• Battery Switch / Load Switch
• Power Management for Tablet PCs
and Mobile Computing
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
20
V
V_GS
± 12
T_C = 25 °C
50^g
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
50^g
24.6^{a, b}
T_A = 70 °C
19.7^{a, b}
A
Pulsed Drain Current (t = 100 μs)
I_DM
200
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
43.3
3.1^{a, b}
Single Pulse Avalanche Current
L = 0.1 mH
I_AS
20
Single Pulse Avalanche Energy
E_AS
20
mJ
T_C = 25 °C
52
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
33
3.7^{a, b}
W
T_A = 70 °C
2.4^{a, b}
Operating Junction and Storage Temperature Range
T_J, T_stg
- 55 to 150
°C
Soldering Recommendations (Peak Temperature)^{c, d}
260
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient^{a, e}
Maximum Junction-to-Case (Drain)
t  10 s
Steady State
Symbol
R_thJA
R_thJC
Typical
24
1.9
Maximum
33
2.4
Unit
°C/W
Notes
a. Surface mounted on 1" x 1" FR4 board.
b. t = 10 s.
c. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
e. Maximum under steady state conditions is 81 °C/W.
f. Based on T_C = 25 °C.
g. Package limited.
S13-1675-Rev. A, 29-Jul-13
1
Document Number: 62874
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000