SIS496EDNT Datasheet, PDF (1/8 Pages) Vishay Telefunken – N-Channel 30 V (D-S) MOSFET

N-Channel 30 V (D-S) MOSFET
SiS496EDNT
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
30
R_DS(on) () Max.
0.0048 at V_GS = 10 V
0.0062 at V_GS = 4.5 V
I_D (A)^a
50
50
Q_g (Typ.)
14 nC
Thin PowerPAK^® 1212-8
3.30 mm
S
1
S
3.30 mm
2
S
3
G
4
D
8
0.75 mm
D
7
D
6
D
5
Bottom View
Ordering Information:
SiS496EDNT-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• TrenchFET^® Power MOSFET
• 100 % R_g and UIS tested
• Thin 0.75 mm height
• Typical ESD performance 2500 V
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
• DC/DC Converter
D
• Battery Switch
• Power Management
G
• For Mobile Computing
N-Channel MOSFET S
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
30
V
V_GS
± 20
T_C = 25 °C
50^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
50^a
20.4^{b, c}
A
T_A = 70 °C
16.3^{b, c}
Pulsed Drain Current (t = 100 µs)
I_DM
200
Avalanche Current
Avalanche Energy
L = 0.1 mH
I_AS
25
E_AS
31
mJ
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
43.3
3.2^{b, c}
A
T_C = 25 °C
52
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
33
3.8^{b, c}
W
T_A = 70 °C
2^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t  10 s
Steady State
Symbol
R_thJA
R_thJC
Typical
24
1.9
Maximum
33
2.4
Unit
°C/W
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The Thin PowerPAK 1212-8 is a leadless package. The end of the lead terminal is ex-
posedcopper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guar-
anteed and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 81 °C/W.
Document Number: 62867
For technical questions, contact: [e-mail]
www.vishay.com
S13-1945-Rev. B, 16-Sep-13
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000