SIS414DN Datasheet, PDF (1/13 Pages) Vishay Siliconix – N-Channel 30 V (D-S) MOSFET

New Product
N-Channel 30 V (D-S) MOSFET
SiS414DN
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
30
R_DS(on) (Ω)
0.016 at V_GS = 4.5 V
0.020 at V_GS = 2.5 V
PowerPAK^® 1212-8
I_D (A)^{a, g}
20
20
Q_g (Typ.)
8.2 nC
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET^® Power MOSFET
• 100 % R_g Tested
• 100 % UIS Tested
• Compliant to RoHS Directive 2002/95/EC
3.30 mm
D
8
D
7
D
6
D
5
S
1
S
3.30 mm
2
S
3
G
4
Bottom View
APPLICATIONS
• Synchronous DC/DC Converter
• System Power, Load Switch for
Notebook
Ordering Information: SiS414DN-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
Drain-Source Voltage
V_DS
Gate-Source Voltage
Continuous Drain Current (T_J = 150 °C)
V_GS
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
I_D
Pulsed Drain Current
Avalanche Current
Avalanche Energy
T_A = 70 °C
I_DM
L = 0.1 mH
I_AS
E_AS
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
T_C = 25 °C
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
T_A = 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
Limit
30
± 12
20^g
20^g
10.8^{b, c}
8.7^{b, c}
50
10
5
20^g
3.0^{b, c}
31
20
3.4^{b, c}
2.2^{b, c}
- 55 to 150
260
D
G
S
N-Channel MOSFET
Unit
V
A
mJ
A
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t ≤ 10 s
Steady State
Symbol
R_thJA
R_thJC
Typical
29
3.3
Maximum
36
4.0
Unit
°C/W
Notes:
a. Based on T_C = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK 1212 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 81 °C/W.
g. Package limited.
Document Number: 66588
S10-1047-Rev. A, 03-May-10
www.vishay.com
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