SIRA18ADP Datasheet, PDF (1/13 Pages) Vishay Telefunken – N-Channel 30 V (D-S) MOSFET

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SiRA18ADP
Vishay Siliconix
N-Channel 30 V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
30
R_DS(on) () MAX.
0.0087 at V_GS = 10 V
0.0135 at V_GS = 4.5 V
I_D (A) ^a
30.6
24.5
PowerPAK^® SO-8 Single
D
D8
D7
D6
5
Q_g (TYP.)
6.9 nC
6.15 _mm
1
Top View
5.15 ^mm
1
2S
3S
4S
G
Bottom View
Ordering Information:
SiRA18ADP-T1-GE3 (lead (Pb)-free and halogen-free)
FEATURES
• TrenchFET^® Gen IV power MOSFET
• 100 % R_g and UIS tested
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
D
• DC/DC conversion
• Battery protection
• Load switching
• DC/AC inverters
G
• Synchronous buck converters
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
V_DS
Gate-Source Voltage
Continuous Drain Current (T_J = 150 °C)
Pulsed Drain Current (t = 300 μs)
V_GS
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
I_D
T_A = 70 °C
I_DM
Continuous Source-Drain Diode Current
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) ^{d, e}
T_C = 25 °C
T_A = 25 °C
L = 0.1 mH
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
I_S
I_AS
E_AS
P_D
T_J, T_stg
LIMIT
30
+20, -16
30.6
24.5
14.5 ^{b, c}
11.5 ^{b, c}
70
13.3
3 ^{b, c}
10
5
14.7
9.4
3.3 ^{b, c}
2.1 ^{b ,c}
-55 to +150
260
UNIT
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum Junction-to-Ambient ^{b, f}
Maximum Junction-to-Case (Drain)
t  10 s
Steady State
SYMBOL
R_thJA
R_thJC
TYPICAL
30
7
MAXIMUM
37
8.5
UNIT
°C/W
Notes
a. Based on T_C = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 70 °C/W.
S15-0734-Rev. A, 13-Apr-15
1
Document Number: 65314
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000