SIRA10DP Datasheet, PDF (1/13 Pages) Vishay Siliconix – N-Channel 30 V (D-S) MOSFET

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SiRA10DP
Vishay Siliconix
N-Channel 30 V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
30
R_DS(on) () (MAX.)
0.0037 at V_GS = 10 V
0.0050 at V_GS = 4.5 V
I_D (A) ^{a, g}
60 ^g
60 ^g
Q_g (TYP.)
15.4 nC
PowerPAK^® SO-8 Single
D
D8
D7
D6
5
6.15 _mm
1
Top View
5.15 ^mm
1
2S
3S
4S
G
Bottom View
Ordering Information:
SiRA10DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• TrenchFET^® Gen IV power MOSFET
• 100 % R_g and UIS tested
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
D
• High power density DC/DC
• Synchronous rectification
• VRMs and embedded DC/DC
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T_J = 150 °C)
Pulsed Drain Current (t = 100 μs)
Continuous Source-Drain Diode Current
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) ^{d, e}
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
T_C = 25 °C
T_A = 25 °C
L = 0.1 mH
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
V_DS
V_GS
I_D
I_DM
I_S
I_AS
E_AS
P_D
T_J, T_stg
LIMIT
30
+20, -16
60 ^g
60 ^g
25 ^{b, c}
23 ^{b, c}
140
34 ^g
4.2 ^{b, c}
20
20
40
26
5 ^{b, c}
3.2 ^{b, c}
-55 to 150
260
UNIT
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYPICAL
MAXIMUM
UNIT
Maximum Junction-to-Ambient ^{b, f}
Maximum Junction-to-Case (Drain)
t  10 s
R_thJA
21
Steady State
R_thJC
2.5
25
°C/W
3.1
Notes
a. Based on T_C = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: Manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 70 °C/W.
g. Package limited.
S14-0158-Rev. B, 03-Feb-14
1
Document Number: 63820
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000