SIR826ADP Datasheet, PDF (1/13 Pages) Vishay Telefunken – N-Channel 80 V (D-S) MOSFET

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SiR826ADP
Vishay Siliconix
N-Channel 80 V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
80
R_DS(on) (Ω) Max.
0.0055 at V_GS = 10 V
0.0059 at V_GS = 7.5 V
0.0087 at V_GS = 4.5 V
I_D (A) ^a
60
60
60
PowerPAK^® SO-8 Single
D
D8
D7
D6
5
Q_g (Typ.)
25 nC
6.15 _mm
1
Top View
5.15 ^mm
1
2S
3S
4S
G
Bottom View
Ordering Information:
SiR826ADP-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• TrenchFET^® power MOSFET
• 100 % R_g and UIS tested
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
D
• Primary side switching
• Synchronous rectification
• DC/AC inverters
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
80
V
V_GS
± 20
T_C = 25 °C
60 ^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
60 ^a
23.8 ^{b, c}
Pulsed Drain Current (t = 300 μs)
T_A = 70 °C
19 ^{b, c}
A
I_DM
100
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
60 ^a
5.6 ^{b, c}
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L = 0.1 mH
I_AS
35
E_AS
61
mJ
T_C = 25 °C
104
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
66.6
6.25 ^{b, c}
W
T_A = 70 °C
4 ^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) ^{d, e}
T_J, T_stg
-55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient ^{b, f}
Maximum Junction-to-Case (Drain)
t ≤ 10 s
R_thJA
15
Steady State
R_thJC
0.9
20
°C/W
1.2
Notes
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: Manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 54 °C/W.
S14-1081-Rev. B, 26-May-14
1
Document Number: 62569
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000