SIR798DP Datasheet, PDF (1/13 Pages) Vishay Telefunken – N-Channel 30 V (D-S) MOSFET with Schottky Diode

New Product
SiR798DP
Vishay Siliconix
N-Channel 30 V (D-S) MOSFET with Schottky Diode
PRODUCT SUMMARY
V_DS (V)
30
R_DS(on) () (Max.)
0.00205 at V_GS = 10 V
0.00300 at V_GS = 4.5 V
I_D (A)^a
60
60
PowerPAK^® SO-8
Q_g (Typ.)
41.6 nC
6.15 mm
D
8
D
7
D
6
D
5
S
1
S
5.15 mm
2
S
3
G
4
Bottom View
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• SkyFET^® Monolithic TrenchFET^®
Power MOSFET and Schottky Diode
• 100 % R_g and UIS Tested
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
• Notebook PC
- Vcore and Memory
- Low Side
D
Schottky Diode
G
Ordering Information:
SiR798DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
N-Channel MOSFET _S
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
30
V
V_GS
± 20
T_C = 25 °C
60^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
60^a
38.2^{b, c}
Pulsed Drain Current (t = 300 µs)
T_A = 70 °C
30.3^{b, c}
A
I_DM
80
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
60^a
5^{b, c}
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L =0.1 mH
I_AS
35
E_AS
61.25
mJ
T_C = 25 °C
83
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
53
5.4^{b, c}
W
T_A = 70 °C
3.4^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t  10 s
R_thJA
18
Steady State
R_thJC
1
23
°C/W
1.5
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 65 °C/W.
Document Number: 63552
www.vishay.com
S11-2182-Rev. A, 07-Nov-11
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000