SIR770DP Datasheet, PDF (1/18 Pages) Vishay Siliconix – Dual N-Channel 30 V (D-S) MOSFET with Schottky Diode

SiR770DP
Vishay Siliconix
Dual N-Channel 30 V (D-S) MOSFET with Schottky Diode
PRODUCT SUMMARY
V_DS
R_DS(on) ()
Channel-1 30 ^{0.021 at VGS = 10 V}
0.025 at V_GS = 4.5 V
Channel-2 30 ^{0.021 at VGS = 10 V}
0.025 at V_GS = 4.5 V
I_D (A)^{a, f}
8.0
8.0
8.0
8.0
Q_g (Typ.)
6.6
6.6
SCHOTTKY PRODUCT SUMMARY
V_DS (V)
30
V_SD (V)
Diode Forward Voltage
0.50 V at 1.0 A
I_F (A)^a
4.0
PowerPAK SO-8
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET^® Power MOSFET
• 100 % R_g and UIS Tested
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
• Fixed Telecom
- Server
• Synchronous Converter
6.15 mm
S1
1
G1
2
5.15 mm
S2
3
G2
4
D1
8
D1
7
D2
6
D2
5
Bottom View
Ordering Information: SiR770DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
D₁
D₂
Schottky Diode
G₁
G₂
S₁
N-Channel MOSFET
S₂
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Channel-1
Channel-2
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
30
30
V
V_GS
± 20
± 20
T_C = 25 °C
8^f
8^f
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
8^f
8^{b, c, f}
8^f
8^{b, c, f}
T_A = 70 °C
8^{b, c, f}
8^{b, c, f}
Pulsed Drain Current (300 µs)
I_DM
35
35
A
Source-Drain Current Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
8^f
3^{b, c}
8^f
3^{b, c}
Pulsed Source-Drain Current
I_SM
35
35
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L = 0.1 mH
I_AS
E_AS
15
11.2
15
11.2
mJ
T_C = 25 °C
17.8
17.8
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
11.4
3.6^{b, c}
11.4
3.6^{b, c}
W
T_A = 70 °C
2.3^{b, c}
2.3^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
Notes:
a. Based on T_C = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Package limited.
Document Number: 66818
S10-1923-Rev. A, 23-Aug-10
www.vishay.com
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