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SIR472ADP Datasheet, PDF (1/13 Pages) Vishay Telefunken – N-Channel 30 V (D-S) MOSFET
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SiR472ADP
Vishay Siliconix
N-Channel 30 V (D-S) MOSFET
PRODUCT SUMMARY
VDS (V)
30
RDS(on) () MAX.
0.0090 at VGS = 10 V
0.0115 at VGS = 4.5 V
ID (A) a, g
18
18
Qg (TYP.)
9 nC
PowerPAK® SO-8 Single
D
D8
D7
D6
5
6.15 mm
1
Top View
5.15 mm
1
2S
3S
4S
G
Bottom View
Ordering Information:
SiR472ADP-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• TrenchFET® Gen IV power MOSFET
• 100 % Rg and UIS tested
• Optimized for high-side switching in
synchronous buck converters
• Material categorization: For definitions of
compliance please see www.vishay.com/doc?99912
APPLICATIONS
• DC/DC conversion
• Battery protection
• Load switching
• DC/AC inverters
D
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
Gate-Source Voltage
VDS
VGS
TC = 25 °C
Continuous Drain Current (TJ = 150 °C)
TC = 70 °C
TA = 25 °C
ID
TA = 70 °C
Pulsed Drain Current (t = 300 μs)
Continuous Source-Drain Diode Current
IDM
TC = 25 °C
TA = 25 °C
IS
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L = 0.3 mH
IAS
EAS
TC = 25 °C
Maximum Power Dissipation
TC = 70 °C
TA = 25 °C
PD
TA = 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) d, e
TJ, Tstg
LIMIT
30
± 20
18 g
18 g
14.2 b, c
11.3 b, c
80
13.3 g
3 b,c
8.2
10
14.7
9.4
3.3 b, c
2.1 b, c
-55 to 150
260
UNIT
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYPICAL
MAXIMUM
UNIT
Maximum Junction-to-Ambient b, f
Maximum Junction-to-Case (Drain)
t  10 s
RthJA
30
Steady State
RthJC
7
37
°C/W
8.5
Notes
a. Based on TC = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 70 °C/W.
g. Package limited.
S14-0133-Rev. B, 27-Jan-14
1
Document Number: 62880
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000